[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC
Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.
- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin
- Company:サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
- Price:Other