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FPC(車載) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
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FPC Product List

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150°C Compatible High-Temperature FPC for Automotive Equipment

The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments such as automotive and industrial equipment applications.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables use in high-temperature environments of up to 150°C. ■ Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Compatible with two types of substrates: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.

  • HF601-xx-02_YFLEX嵌合.jpg
  • イプロス_高耐熱FPC_信頼性評価項目_一覧表.png
  • Wiring materials
  • FPC

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High-precision multilayer flexible printed circuit board (MFS Technology)

We handle products from MFS Technology, which has many actual deliveries in mobile and automotive displays!

MFS Technology was founded in 1989 and is headquartered in Singapore, being an FPC manufacturer with a significant track record of deliveries for mobile and automotive displays. Additionally, it is a PCB manufacturer primarily focused on heavy copper. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • FPC

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

  • 多層1.jpg
  • Other electronic parts
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

  • MSAPマンガ.png
  • ビアフィリングマンガ.png
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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FPC "Multi-layer (MULTI)"

It's perfect for Mobile Connector and more!

This product is a multi-layer Multi specification FPC suitable for recent trends in high density, high functionality, and lightweight design. We offer two types in our lineup: "4 Layer" and "5 Layer," tailored to various applications. Additionally, our company provides high-quality and cost-effective components and materials required for electronic displays, including LCDs, OLEDs, and touch panels, both domestically and internationally, including automotive applications. Please feel free to contact us for inquiries. 【Features】 ■ Supports high density, high functionality, and lightweight design ■ Multi-layer Multi specification *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • FPC

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Single-sided FPC "Digital Camera"

Single-sided FPC available for a wide range of applications!

The FPC "Digital Camera" is a single-sided FPC that is optimal for use in OLED Modules and PDP Modules. It can also be used in applications such as the drive units of inkjet printers and RFID antennas. Our company provides high-quality and affordable components and materials required for electronic displays, including LCDs, OLEDs, and touch panels, both domestically and internationally, including automotive applications. Please feel free to contact us. 【Features】 ■ Optimal for use in OLED Modules and PDP Modules ■ Usable in the drive units of inkjet printers as well *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • FPC

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Double-sided FPC "Car Navigation"

Double-sided FPC is optimal for use in organic EL modules and car navigation systems!

"Car Navigation" is a double-sided FPC that is optimal for car navigation applications, including organic EL modules. We also offer "LCD Modules" that can be used in small LCD modules and the bending parts of slide-type mobile phones, tailored to your needs. Furthermore, our company provides high-quality and affordable components and materials required for electronic displays, including LCDs, OLEDs, and touch panels, both domestically and internationally, including those for automotive use. Please feel free to consult us. [Features] ■ Optimal for organic EL modules and car navigation applications ■ A lineup of double-sided FPCs tailored to various applications *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • FPC

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FPC (Flexible Printed Circuit Board)

We accommodate everything from small lots to a wide variety of products!

Our company handles FPC (Flexible Printed Circuit Boards) and provides a consistent production system from design to prototyping and mass production. We can supply products to China and overseas with single-sided, double-sided, printed punch, double access, multilayer (4 layers), long-length (up to 700mm) flexible boards, and manual assembly. Please feel free to contact us if you have any requests. 【Features】 ■ SMT assembly (handled by subcontractors) ■ In-house mold manufacturing ■ Halogen-free substrate support ■ Lead-free solder plating/Au plating (electrolytic/non-electrolytic) *For more details, please download the PDF or feel free to contact us.

  • Company:JOIE
  • Price:Other
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC

A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Prototype/Flexible Circuit Board Design Expert

- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract manufacturing
  • FPC

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Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

We can accommodate the production of printed circuit boards with various specifications! FPC

- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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EMS - Comprehensive Contracting Services

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜  ☆ ~ ☆ ~ Do you have any of the following concerns? ~☆ ~ ☆   • Looking for a reliable manufacturing partner for new product development   • Considering outsourcing as you do not have a manufacturing line   • Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

  • EMS 電子機器受託製造サービス 扉絵-3.png
  • EMS20260409.jpg
  • ワンストップ.png
  • Circuit board design and manufacturing
  • EMS
  • FPC

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[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC

- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

We handle the design, manufacturing, and procurement of peripheral components for printed circuit boards, saving development personnel time! FPC

- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.

- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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Supports high temperatures of 150℃! Suitable for use in automotive and high-temperature environments FPC.

Securing long-term reliability at 150℃ for 3,000 hours.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables usage in high-temperature environments up to 150°C. ■Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.

  • HF601-xx-02_YFLEX嵌合.jpg
  • イプロス_高耐熱FPC_信頼性評価項目_一覧表.png
  • Wiring materials
  • FPC

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【For industrial equipment】150℃ compatible high heat-resistant FPC

The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments, including automotive and industrial equipment applications.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when used in combination with our 150°C rated FPC connector HF601 series, it enables use in high-temperature environments up to 150°C. ■ Features - Long-term reliability ensured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C rated products.

  • HF601-xx-02_YFLEX嵌合.jpg
  • イプロス_高耐熱FPC_信頼性評価項目_一覧表.png
  • Wiring materials
  • FPC

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