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It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC
A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC
![[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC](https://image.mono.ipros.com/public/product/image/04e/2000509891/IPROS14150629607051954324.jpeg?w=280&h=280)
Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.
- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin
