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Implementation Services Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Implementation Services Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  2. ジャパンギャルズSC 東京オフィス Tokyo//others
  3. 松本加工 Shizuoka//Resin/Plastic
  4. 4 TKR Tokyo//Consumer Electronics
  5. 5 平和電機 Kyoto//Electronic Components and Semiconductors

Implementation Services Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Japan Gals Inc. Business Introduction ジャパンギャルズSC 東京オフィス
  2. OKI JIP Corporation - Company Profile 沖電気工業 産業営業本部 産業営業統括室
  3. OKI Circuit Technology Implementation Services 沖電気工業 産業営業本部 産業営業統括室
  4. Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding." 松本加工
  5. 4 Delivery possible in as short as 1 day! PCB assembly service that also supports small-scale production. 平和電機

Implementation Services Product List

61~75 item / All 127 items

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Printed circuit board assembly service

Printed circuit board assembly service with a state-of-the-art SMD assembly line configuration compatible with the latest devices.

We provide circuit board assembly specialized in small to medium quantities with a wide variety of products. We introduce the latest equipment every year and can accommodate high-density circuit board assembly. To meet our customers' requests for "short delivery times for development," we manage processes and equip facilities to ensure we can deliver high quality and short lead times with reliable technology and equipment. We also maintain a stock of components centered around chip CR. Please feel free to contact us with any questions or consultations regarding circuit board assembly. ■ Circuit Board Assembly Points - We can handle medium lot production (track record: 5,000 units/month). - We accommodate the assembly of small components such as 0402 chips. - We support flip chip assembly and POP (Package on Package) assembly. - We accept not only reel components but also loose components for assembly. - We manufacture metal masks with a short lead time of 1 night and 2 days at low prices. - We provide rework and reballing for BGA, X-ray inspection, and visual inspection. - We have a stock of over 3,000 types of chip CR.

  • Printed Circuit Board

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."

"Hot melt molding," which is increasingly being adopted for waterproofing and insulating sealing of substrates and electronic components. We are offering a sample of an LED substrate sealed with hot melt molding for free.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

  • Other Auto Parts
  • Other polymer materials
  • Electrical equipment parts

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Implementation service

We respond to various requests related to PCB assembly, such as production of small lots and short delivery times!

At Kyo-sha, we respond to various requests related to circuit board assembly. Utilizing the technology and experience we have accumulated, we deliver high-quality circuit board assembly. We flexibly accommodate various methods, from machine assembly to manual soldering. From prototypes to mass production, we propose methods that can address issues and support mass production, leveraging the expertise of both fixture manufacturers and assembly manufacturers to achieve high-quality and efficient assembly. Additionally, we are engaged in the development of new technologies, including new materials and new methods. Please feel free to consult with us. 【Strengths】 ■ Capable of handling small lot prototypes to mass production ■ Management system through a traceability system ■ Skilled techniques to accommodate special processes ■ Repair and analysis support *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other services

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EMS Service [Case Study]

EMS support available! We provide one-stop service from design to parts procurement, implementation, and assembly.

At Kei All's EMS service, we provide proposals that satisfy our customers regarding total quality, cost, and delivery time, with a focus on implementation and manufacturing, which we can uniquely offer as an implementation company. We accept contracts for various processes, either as a whole or by individual steps, including PCB design, PCB ordering, component purchasing, metal mask ordering, assembly, simple testing, coating work, X-ray inspection, cleaning (AS-300), underfill application, 0402/0201 chip modification and repair, PCB splitting, assembly testing, retrofitting only, visual inspection only, and pattern modification. 【Features】 ○ EMS compatible ○ One-stop service from design to assembly and integration ○ Support for PCB shape, component placement, and component selection ○ Total support for quality, cost, and delivery time For more details, please contact us or download the catalog.

  • Other contract services

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Taclum Plus board for MMIC implementation

Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.

Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.

  • Other semiconductors

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Printed circuit board assembly service

Providing circuit board assembly services utilizing years of know-how and technology! Responding to a wide range of needs from prototyping to mass production.

Our company handles everything from prototype production to small-lot, multi-variety printed circuit board assembly and finished product assembly. Utilizing our long-established manufacturing technology and know-how, we design suitable lines based on the characteristics of the production models and work on improving reliability. We provide a consistent system for our customers, from component procurement to board assembly and finished product assembly. We are a manufacturing company that responds to various needs. 【Features】 ■ Flexibly responds to complex tasks that are difficult to automate ■ Meets a wide range of needs from prototyping to mass production ■ Supports prototyping and small-lot production from one unit ■ Achieves low costs ■ Confident in assembly quality ■ Designs special nozzles based on component shapes *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • Printed Circuit Board
  • Other mounting machines

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Service - Paper Content Implementation Service

Intelligent Information System Paper Content Implementation Service

The paper content implementation service is a service that implements the content of a paper specified by the researcher in accordance with the designated methods and environments. By basing the software specifications on the paper, it is possible to develop at a lower cost than usual.

  • Other services

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M.I.A. Printed Circuit Board Wiring Design and Assembly Services

We have established a system that allows us to consistently handle everything from printed circuit board wiring design to component procurement.

We have established a system that allows us to consistently handle everything from printed circuit board wiring design to component procurement. In our customers' projects, we will take full responsibility for the implementation aspects, managing the traditionally separate tasks of board creation and component procurement. This enables us to provide our customers with reliable solutions that meet their envisioned design goals.

  • Other core systems

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Printed circuit board assembly service

Reship Electronics flexibly responds to all needs such as implementation density, types of solder, and lot sizes.

This is an introduction to the printed circuit board assembly services offered by Reship Electronics. We can meet a wide range of requirements, including the assembly of very small components, assembly of industrial equipment, small-batch production of various types, and mass production. *For more details, please download the catalog or contact us directly.*

  • Technical and Reference Books

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COB high-density implementation problem solving

Leave the implementation challenges to us! We will propose solutions with our unique design and know-how.

We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines

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Flexible Printed Circuit Board (FPC) Assembly Service

Consistent support from flexible printed circuit boards (FPC) to implementation.

Yamashita Material offers a comprehensive service from FPC manufacturing to component mounting, inspection, and final packaging. We perform fine mounting in-house from 0402 chips to 0603 chips, and we also accommodate high-density mounting such as BGA and wire bonding. We provide flexible support from prototyping to mass production, achieving high-quality and efficient manufacturing with a rapid response time of as short as one day.

  • Printed Circuit Board

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Initial implementation, retrofitted implementation

Prototype boards are assembled with manual placement to cut initial costs. Quick turnaround finish.

Our company has several experienced hand soldering staff members. We can hand solder components as small as 0402. If you only need to produce a few pieces for prototypes or have around 100 components, using hand soldering can reduce costs by eliminating programming and metal mask fees, providing a financial advantage. Of course, we can also work with loose components, and we can implement them onto universal boards by reading circuit diagrams. We can accommodate short lead times as well (please consult us). We can also handle machine assembly (IR infrared) for BGA, QFN (with thermal pads), Enpirion, connectors, and more. For leadless components, we will inspect them using X-ray (with a 60-degree tilt) after assembly. Please leave any corrections for assembly defects to us. We offer high quality to our customers along with cost and lead time benefits. Please consider our hand soldering services.

  • Prototype Services

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COB for PWB

Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.

"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties. By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product. Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks. 【Features】 ■ Chips mounted within the cavity ■ Achieves miniaturization and thinness of devices ■ Supports electrolytic gold plating and electroless gold plating ■ Stable bonding properties ■ Unique mold design reduces dust generation from the edges after exterior pressing *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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