Achieves high-quality microprocessing with reduced thermal damage. Suitable for processing brittle materials such as difficult-to-cut materials, ceramics, glass, and films.
Ultrafast pulse laser processing is a method of fine machining using lasers with short pulse widths (such as picoseconds and femtoseconds). Ultrafast pulse lasers have minimal thermal effects and result in high-quality finishes. They achieve high-quality results even on brittle materials such as ceramics, glass, silicon, and films. Additionally, with a unique taper angle control feature, it is possible to process arbitrary hole shapes with high precision, allowing for customization according to customer requirements.
Features:
Our ultrafast pulse laser processing has the following features:
- Non-thermal processing using femtosecond lasers reduces burrs and microcracks, enabling high-speed machining.
- High-quality processing of difficult-to-machine materials such as hard metals, ceramics, glass, and silicon.
- Processing with taper angle control allows for the realization of arbitrary shapes, including straight holes, reverse taper machining, and holes of shapes other than round.
- Large stage capability for processing large workpieces (maximum work size: 500mm square) can meet demands for fine and precise machining on large workpieces, such as applications requiring adhesion to the stage.
*You can view service introduction materials that showcase processing examples by downloading the PDF.
![[Laser Processing Example] Laser Processing Example 3](https://image.mono.ipros.com/public/product/image/703/2000232872/IPROS4053333556092619396.JPG?w=280&h=280)
![[3D Laser Processing Examples] 3 Equipment Manufacturing/Design](https://image.mono.ipros.com/public/product/image/65f/2001177011/IPROS9443110753917482762.jpg?w=280&h=280)
