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This is a device that detects the edge of a wafer and measures its diameter through image processing.
- The diameter of the wafer is measured non-contact. - By rotating the stage, it also accommodates the diameter of the orifice surface and the depth of the notch. - The camera mounting section has a mechanism that allows for manual adjustment in the vertical direction.
This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.
The measured data can be saved and displayed graphically on the accompanying PC. This device measures the thickness of the wafer attached to the plate and allows you to check the grinding condition before and after grinding while the wafer is attached to the plate.
This machine is a device for measuring the thickness of φ4, 5, 6, and 8-inch wafers.
Thickness measurement is performed using multi-point measurements according to the recipe. The measurement sensor uses a spectroscopic interference method sensor to perform measurements from one side.
