This machine is a device for measuring the thickness of φ4, 5, 6, and 8-inch wafers.
Thickness measurement is performed using multi-point measurements according to the recipe. The measurement sensor uses a spectroscopic interference method sensor to perform measurements from one side.
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basic information
- We can offer the same functionality as other companies at a lower price. We can also offer low-cost solutions by narrowing down the necessary equipment. - Using a Bernoulli-type hand, we can also transport thin wafers. The transport unit is equipped with a φ4-inch, 5-inch, and 6-inch compatible hand and a φ8-inch dedicated hand, enabling operation without the need for setup changes. - From the TME-07 model, the addition of cassette capacity, alignment mechanisms, and transport units has resulted in a low-cost device specification with superior performance.
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Applications/Examples of results
We have a track record of deliveries to the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
![High-precision non-contact thickness measurement device [for semiconductor wafers]](https://image.mono.ipros.com/public/product/image/1d5/2000611778/IPROS45880960576095588662.png?w=280&h=280)
