Case Study of Die Set Molding Processing for Electronic Devices: Cover Film Cutting Processing
With a pressing capacity of 100 kN and a stroke speed of 60 spm! An example of punching from the upper side of a paper separator.
We would like to introduce a case study of our company's "Cover Film Die Cutting" die set mold processing. The material width is 250mm in roll form. The material composition consists of a heat-resistant carrier film of 50μm, a PI film of 9μm, an adhesive layer of 20μm, and a paper separator of 150μm, with a total thickness of 229μm. We used a "SSD1000-ASF automatic press machine with linear feeding device" manufactured by Sekiguchi Seisakusho, and the punching was performed from the upper side of the paper separator. 【Overview of Processing Case (Partial)】 ■ Material Composition: Total thickness 229μm - Heat-resistant carrier film 50μm - PI film 9μm - Adhesive layer 20μm - Paper separator 150μm ■ Material Width: 250mm ■ Material Form: Roll ■ Dimensional Tolerance: ±0.1mm *For more details, please feel free to contact us.
- 企業:関口製作所
- 価格:Other