Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
181～195 item / All 2113 items
DLAP series for edge AI, equipped with NVIDIA Jetson TX2 NX.
Features ■ Width 148 × Height 50 × Depth 105 mm, 0.78 liters ■ NVIDIA Jetson TX2 CPU, fanless ■ I/O connectors: 1 HDMI, 2 GbE, 4/3 USB 3.0, 1 COM
For digital signage, AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz
Features ■215.8mm(W) x 164mm(H) x 45mm(D) / ■AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz ■Supports 2x DDR4-2400 memory up to 32GB ■4x HDMI 2.0 (with EDID emulator) ■Rich expansion slots ■Mini PCIe (Full-size): for communication such as Wi-Fi, Bluetooth, 4G LTE ■M.2 E-Key (2230): for communication such as Wi-Fi, Bluetooth ■1x SIM card slot
For digital signage, 8th generation Intel Core mobile processor (TDP <= 25W)
Features ■ 175mm(W) x 116mm(H) x 30mm(D) ■ Ample expansion slots ■ M.2 E-Key (2230) for card capture ■ M.2 M-Key (2280) for memory ■ 1x M.2 B-Key (3042) for 4G LTE ■ Intel Core i7-8665UE processor ■ 2x DDR4 2400 SO-DIMM (up to 32GB)
Railway/vehicle use, Intel Atom x7-E3950 processor, 64G MLC SSD, 9V~32VDC input.
Features ■340 (W) x 183.4 (D) x 67.6 (H) mm ■Intel Atom x7-E3950 processor ■Abundant expansion slots ■1x miniPCI-E full/Half-size, supports mSATA ■1x miniPCI-E full/Half-size, supports second SIM card ■shared with M.2 slot ■1x M.2 B-key 30x42 with USB 2.0 and USB 3.0 signal only ■4x Gigabit LAN ■512k SRAM on board ■2.5-inch drive bay
For embedded systems, AMD Embedded Ryzen Series SoC V1605B/V1202B/R1606G/1505G
Features ■240mm (W) x 162mm (D) x 42mm (H) 1.63 liters ■Ryzen Series SoC V1605B/V1202B/R1606G/1505G ■Internal expansion: 2x M.2 (E-Key / M-Key) ■Fanless operation temperature ■I/O connectors (front) ■1x Power LED/ 1x HDD LED/ 1x RST button/ ■1x USB 3.0/2.0 by V1605B/ V1202B/ R1606G/ R1505G ■3x DB9 for COM#2~4 (RS232) etc. ■I/O connectors (rear) ■4 x USB 3.1, 2x HDMI (2.0a), 1x DB9 for COM#1 (RS232/422/485) ■2x LAN, 1x Digital I/O (4-in/4-out) ■1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%) ■2x Antenna holes etc.
Equipped with 8th generation Core i mobile CPU for embedded systems.
Features ■ 180mm(W) x 150mm(D) x 66mm(H) 1.78 liters ■ 8th generation Core i7-8665UE / i5-8365UE / i3-8145UE CPU ■ Internal expansion slots 2x M.2 (E-Key, M-Key) ■ I/O connectors (front) ■ 4x USB 3.1, 2x DP, 1x DB9 for COM#1 (RS232/422/485), 2x Gigabit LAN ■ I/O connectors (rear) ■ 1x Power button, 1x Digital I/O (4-in/4-out), 2x Antenna holes, 1x HDD LED, 1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%)
Railway and automotive applications, 11th generation CPU compatible, extended temperature range support.
Features ■ Width 150.4 × Height 59.9 × Depth 106.2 mm, 0.96 liters ■ 11th generation Intel Core i7/i5/i3 CPU (Tiger Lake UP3) ■ Fanless operation (up to 15W TDP CPU) ■ DDR4-3200MHz (up to 32GB) ■ 4K resolution support, 2 DisplayPort outputs ■ 1 GbE, 1 2.5GbE, 2 USB3.1, 4 USB2.0, 2 COM, 1 Nano SIM Card ■ Extended temperature range -40 to 75℃ (with 15W TDP CPU) ■ Wide DC input 9 to 55V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified ■ Operating temperature -40 to 70℃ ■ Compatible with Win 10 and Linux ■ DC 9 to 55V input (3-pin terminal block: On, Off, IGN)
Railway, vehicle-mounted, 11th generation CPU compatible, extended temperature range support.
Features ■ Width 150.4 × Height 44.2 × Depth 106.2 mm, 0.91 liters ■ 11th generation Intel Core i7/i5/i3 CPU (Tiger Lake UP3) ■ Fanless operation (up to 15W TDP CPU) ■ DDR4-3200MHz (up to 32GB) ■ 4K resolution support, 2 DisplayPort outputs ■ 1 GbE, 1 2.5GbE, 2 USB3.1, 4 USB2.0, 2 COM, 1 Nano SIM Card ■ Extended temperature support -40 to 75℃ (when equipped with 15W TDP CPU) ■ Wide DC input 9 to 55V (3-pin terminal block: On, Off, IGN) ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified ■ Operating temperature: 12W TDP CPU: -40 to 65℃
For small embedded systems, equipped with NVIDIA Jetson Xavier NX CPU, supporting extended temperature range.
Features ■ Width 150 × Height 62 × Depth 106.2 mm (EAC-2100) 0.99 liters ■ Width 150 × Height 50 × Depth 106.2 mm (EAC-2000) 0.8 liters ■ CPU NVIDIA Jetson Xavier NX, GPU NVIDIA Volta fanless operation ■ 8GB LPDDR4 ■ 1 M.2 Key M (2280), 1 M.2 Key B (3042/3052), 1 M.2 Key E (2230) ■ 4 GbE (2 PoE), 4 USB 3.1, 2 COM ■ 1 CAN, supports 4 GMSL cameras (EAC-2100) ■ Extended temperature range -25 to 70°C ■ Wide DC input 9 to 50V
Arestech panel PC, equipped with a Celeron J1900 2GHz CPU, featuring a projected capacitive touch panel, modular type.
Features ■10.4" XGA TFT LCD ■Intel Celeron processor J1900, up to 2.42GHz ■Patented Display Conversion Device (DCD) technology ■IP65 flat front panel ■Designed with an aluminum die-cast ultra-thin front frame ■Built-in power protection ■1x USB3.2 Gen 2, 4x USB2.0, 2x RS232/422/485, 2x GbE, 1x DP, 1x VGA ■2 x 2W built-in speakers ■9~48V DC ■Supports panel mount / VESA mount / wall mount (optional) ■Operating temperature -20℃ to 70℃
Arestech touch panel PC, equipped with a Celeron J1900 2GHz CPU, projected capacitive touch panel, modular type.
Features ■ 12.1" XGA TFT LCD ■ Fanless cooling system ■ Low power consumption CPU Celeron J1900 2GHz ■ Memory DDR3L-1066/1333 up to 8GB ■ mSATA SSD support ■ AT/ATX power supply selectable ■ Built-in speakers ■ IP65 front waterproof/dustproof bezel ■ Flat bezel, projected capacitive touch panel ■ Wide DC input power 9–48V ■ VESA 100mm/Wall mount support
Arestech panel PC, equipped with a Celeron J1900 2GHz CPU, featuring a projected capacitive touch panel, modular type.
Features ■15.6" 16:9 (1920 x 1080), 450 nits ■Intel Celeron Processor J1900, up to 2.42GHz ■Patented Display Conversion Device (DCD) technology ■IP65 flat front panel ■Designed with aluminum die-cast ultra-thin front frame ■Built-in power protection ■1x USB3.2 Gen 2, 4x USB2.0, 2x RS232/422/485, 2x GbE, 1x DP, 1x VGA ■2 x 2W built-in speakers ■9~48V DC ■Supports panel mount / VESA mount / wall mount (optional) ■Operating temperature -20℃ to 70℃
Arestech panel PC, equipped with 9th/8th generation Core i7/i5/i3 CPU, projected capacitive touch panel, modular type.
Features ■ 17" SXGA TFT LCD ■ Fanless cooling system (35W CPU) ■ 9th/8th generation Core i7/i5/i3 CPU ■ Memory DDR4-2400/2666 up to 64GB ■ mSATA SSD support ■ AT/ATX power supply selectable ■ Built-in speakers ■ IP65 front waterproof/dustproof bezel ■ Flat bezel, projected capacitive touch panel ■ Wide DC input power 9–48V ■ VESA 100mm/Wall mount support
Arestech panel PC, equipped with 9th/8th generation Intel Core i LGA CPU, CTP touch panel, and aluminum die-cast chassis.
Features ■21.5" 16:9 FHD (1920 x 1080) ■8th/9th Generation Intel Core i LGA1151 Processor ■Patented Display Conversion Device (DCD) Technology ■IP65 Front Panel ■Designed with Aluminum Die-Cast Ultra-Thin Front Frame ■Built-in Power Protection ■6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE ■1x DP, 1x VGA, 1x DVI-D ■Contrast Ratio 5000:1 ■Input Power: 9~48V DC ■Supports Panel Mount / VESA Mount (100 x 100 mm) / Wall Mount (Optional)
Arestech panel PC, equipped with 9th/8th generation Core i7/i5/i3 CPU, projected capacitive touch panel, modular type.
Features ■ 24" FHD TFT LCD ■ Fanless cooling system (35W CPU) ■ 9th/8th generation Core i7/i5/i3 CPU ■ Memory DDR4-2400/2666 up to 64GB ■ mSATA SSD support ■ AT/ATX power supply selectable ■ Built-in speakers ■ IP65 front waterproof/dustproof bezel ■ Flat bezel, projected capacitive touch panel ■ Wide DC input power 9-48V ■ VESA 100mm/Wall mount support
