Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
211～225 item / All 2747 items
6th generation Core i7/i5/i3/Celeron, On-board 4GB/8GB + 1xDDR4-2133 maximum 16GB
Features ■ Equipped with 6th generation Core i7/i5/i3/Celeron ULT processors ■ DDR4 DO-DIMM socket ■ Supports triple display (VGA/iDP + HDMI + LVDS) ■ mSATA/SIM compatible PCIe mini slots × 2 slots ■ Gigabit LAN port supporting AMT 11.0 ■ Includes IEI One Key Recovery Solution (OS backup software)
OMNI Series 15" Fanless Panel PC
Features ■ 15" XGA TFT LCD ■ Fanless cooling system ■ Atom x5-Z8350 1.44GHz ■ IP65 front waterproof/dustproof bezel ■ Supports projected capacitive/5-wire resistive touch panel ■ I/O expansion via OMNI I/O module
12" Military-grade touchscreen PC, Core i7/i5/i3 CPU, GTX950M GPU, full IP65, high brightness 1000NIT
Features ■ 12" XGA TFT LCD ■ Fanless cooling system ■ CPU Core i7-7600U/i5-7300U/i3-7100U ■ GPU NVIDIA GeForce GTX950M ■ MIL-STD-810G certified (temperature, shock, vibration, humidity, EMI, EMC) ■ Durable full IP65 aluminum chassis with MIL-DTL-38999 connector ■ 5-wire resistive (Glass-Film-Glass protection) touch panel ■ IP65 fully waterproof/dustproof ■ 6 programmable function keys ■ Extended operating temperature -30 to 60℃ ■ Wide DC input 9 to 36V
Railway and in-vehicle use, equipped with Intel 8th generation Core i7-8665UE/i3-8145UE CPU, supports extended temperature range.
Features ■ Width 224 × Height 32.6 × Depth 149 mm, 1.09 liters ■ 8th Generation Intel Core i7-8665UE/i3-8145UE CPU (Whiskey Lake) ■ Two DDR4 2400MHz memory slots, expandable up to 64GB ■ Two DP ports supporting high-definition 4K video output ■ Four USB 3.1 ports, capable of data transfer up to 10Gbps ■ Four independent GigE LAN ports, supporting IEEE 802.3at PoE+ (2 ports) ■ 5G/WiFi/4G/3G/LTE/GPRS/UMTS support via SIM socket ■ Four COM ports (RS-232/422/485), equipped with 16 isolated DIO ■ Wide DC power input range of 9V to 50V ■ Extended operating temperature range of -40℃ to 85℃, with a clean cable-free design ■ Ignition control capable (16 modes), supports TPM 2.0 ■ Rich expansion features (M.2 Key B, M, E and Mini PCIe)
Equipped with 9th/8th generation CPU, Edge AI GPU computing, and extended temperature support.
Features ■ Width 250 × Height 137 × Depth 260 mm, 8.9 liters ■ 9th/8th generation Core i7/i5/i3 CPU, fanless operation ■ DDR4-2666/2400MHz (up to 32GB) ■ 4K resolution support, 3 display outputs (1 DP, 1 HDMI, 1 DVI-I) ■ 1 PCIe[x16] (option: 2 PCIe[x16] ([x8] signal)) ■ 2 2.5" HDD, 1 M.2 (M key 2280/2242) ■ 6 GbE (option: 4 PoE), 4 USB3.0, 4 COM, 2 GPIO ■ Extended temperature support -40 to 70°C ■ Wide DC input 9 to 48V, controlled by ignition key ■ Internal battery UPS can be installed (optional)
Railway and vehicle-mounted, compatible with 10th generation CPUs, capable of mounting PEG graphics cards, supports extended temperature range.
Features ■ Width 260 × Height 79 × Depth 240 mm, 4.93 liters ■ 10th Generation Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ DDR4-2933MHz (up to 64GB) ■ Can supply power to graphics cards up to 250W ■ 1 VGA, 1 DVI-D, 2 DP (supports 4K resolution), 4 independent display outputs ■ Expansion features: 1 PCIe [x16], 1 M.2 KeyB, 1 M.2 KeyE, 2 Mini PCIe ■ 2.5" HDD front access for 2 drives ■ 6 USB3.2, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 2GbE / 2GbE + 4 PoE ■ Extended temperature support -20 to 45°C ■ Wide DC input 12 to 50V ■ Control via ignition key through software ■ Railway standard EN50155 certified
DLAP series for edge AI, equipped with 9th/8th generation Core i7/i5/i3, optional MXM graphics module.
Features ■ Width 235 × Height 75 × Depth 182 mm, 3.21 liters ■ CPU 9th/8th generation Core i7/i5/i3/Celeron ■ ADLINK MXM graphics module compatible (Type A/B, maximum 120W) ■ Memory DDR4 SO-DIMM (maximum 64GB) ■ Display 6 DisplayPort (2 CPU + 4 MXM) ■ I/O connectors 4 GbE (1 x i219-LM, 3 x i210-AT), 2 COM
DLAP series for edge AI, equipped with NVIDIA Jetson Nano NX.
Features ■ Width 210 × Height 55 × Depth 170 mm, 1.96 liters ■ NVIDIA Jetson Nano CPU Fanless (DLAP-301-Nano) ■ I/O Connectors: 8 PoE (for IP cameras), 1 HDMI, 1 GbE, 3 USB 3.0, 2 COM
DLAP series for edge AI, equipped with NVIDIA Jetson TX2 NX.
Features ■ Width 148 × Height 50 × Depth 105 mm, 0.78 liters ■ NVIDIA Jetson TX2 CPU, fanless ■ I/O connectors: 1 HDMI, 2 GbE, 4/3 USB 3.0, 1 COM
For digital signage, AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz
Features ■215.8mm(W) x 164mm(H) x 45mm(D) / ■AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz ■Supports 2x DDR4-2400 memory up to 32GB ■4x HDMI 2.0 (with EDID emulator) ■Rich expansion slots ■Mini PCIe (Full-size): for communication such as Wi-Fi, Bluetooth, 4G LTE ■M.2 E-Key (2230): for communication such as Wi-Fi, Bluetooth ■1x SIM card slot
For digital signage, 8th generation Intel Core mobile processor (TDP <= 25W)
Features ■ 175mm(W) x 116mm(H) x 30mm(D) ■ Ample expansion slots ■ M.2 E-Key (2230) for card capture ■ M.2 M-Key (2280) for memory ■ 1x M.2 B-Key (3042) for 4G LTE ■ Intel Core i7-8665UE processor ■ 2x DDR4 2400 SO-DIMM (up to 32GB)
Railway/vehicle use, Intel Atom x7-E3950 processor, 64G MLC SSD, 9V~32VDC input.
Features ■340 (W) x 183.4 (D) x 67.6 (H) mm ■Intel Atom x7-E3950 processor ■Abundant expansion slots ■1x miniPCI-E full/Half-size, supports mSATA ■1x miniPCI-E full/Half-size, supports second SIM card ■shared with M.2 slot ■1x M.2 B-key 30x42 with USB 2.0 and USB 3.0 signal only ■4x Gigabit LAN ■512k SRAM on board ■2.5-inch drive bay
For embedded systems, AMD Embedded Ryzen Series SoC V1605B/V1202B/R1606G/1505G
Features ■240mm (W) x 162mm (D) x 42mm (H) 1.63 liters ■Ryzen Series SoC V1605B/V1202B/R1606G/1505G ■Internal expansion: 2x M.2 (E-Key / M-Key) ■Fanless operation temperature ■I/O connectors (front) ■1x Power LED/ 1x HDD LED/ 1x RST button/ ■1x USB 3.0/2.0 by V1605B/ V1202B/ R1606G/ R1505G ■3x DB9 for COM#2~4 (RS232) etc. ■I/O connectors (rear) ■4 x USB 3.1, 2x HDMI (2.0a), 1x DB9 for COM#1 (RS232/422/485) ■2x LAN, 1x Digital I/O (4-in/4-out) ■1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%) ■2x Antenna holes etc.
Equipped with 8th generation Core i mobile CPU for embedded systems.
Features ■ 180mm(W) x 150mm(D) x 66mm(H) 1.78 liters ■ 8th generation Core i7-8665UE / i5-8365UE / i3-8145UE CPU ■ Internal expansion slots 2x M.2 (E-Key, M-Key) ■ I/O connectors (front) ■ 4x USB 3.1, 2x DP, 1x DB9 for COM#1 (RS232/422/485), 2x Gigabit LAN ■ I/O connectors (rear) ■ 1x Power button, 1x Digital I/O (4-in/4-out), 2x Antenna holes, 1x HDD LED, 1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%)
Railway and automotive applications, 11th generation CPU compatible, extended temperature range support.
Features ■ Width 150.4 × Height 59.9 × Depth 106.2 mm, 0.96 liters ■ 11th generation Intel Core i7/i5/i3 CPU (Tiger Lake UP3) ■ Fanless operation (up to 15W TDP CPU) ■ DDR4-3200MHz (up to 32GB) ■ 4K resolution support, 2 DisplayPort outputs ■ 1 GbE, 1 2.5GbE, 2 USB3.1, 4 USB2.0, 2 COM, 1 Nano SIM Card ■ Extended temperature range -40 to 75℃ (with 15W TDP CPU) ■ Wide DC input 9 to 55V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified ■ Operating temperature -40 to 70℃ ■ Compatible with Win 10 and Linux ■ DC 9 to 55V input (3-pin terminal block: On, Off, IGN)
