Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution
Achieving thin film deposition of electroless copper plating! Electroless copper plating process for semi-additive manufacturing with excellent connection reliability.
We have developed a new electroless copper plating process called "OPC FLET process" to meet the demands for fine wiring and contribute to the densification of semiconductor package substrates. In addition to the OPC FLET copper, which excels in uniform deposition within via holes, we have also developed a new electroless copper plating solution that achieves low film thickness and high reliability for through holes in printed circuit boards. We offer a range of products that can meet various customer needs.
- Company:奥野製薬工業 大阪・放出、東京、名古屋など
- Price:Other