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Plating Solution×奥野製薬工業 - List of Manufacturers, Suppliers, Companies and Products

Plating Solution Product List

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Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

Achieving thin film deposition of electroless copper plating! Electroless copper plating process for semi-additive manufacturing with excellent connection reliability.

We have developed a new electroless copper plating process called "OPC FLET process" to meet the demands for fine wiring and contribute to the densification of semiconductor package substrates. In addition to the OPC FLET copper, which excels in uniform deposition within via holes, we have also developed a new electroless copper plating solution that achieves low film thickness and high reliability for through holes in printed circuit boards. We offer a range of products that can meet various customer needs.

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White decorative trivalent chromium plating solution "Top Fine Chrome BLW"

A trivalent chromium plating solution that achieves a beautiful bluish-white appearance equivalent to hexavalent chromium plating and has excellent uniform electrodeposition properties.

Decorative chrome plating is widely used in automobiles, bicycles, motorcycles, and faucets due to its excellent corrosion and wear resistance. Decorative chrome plating using hexavalent chromium is subject to regulations such as the RoHS directive and wastewater regulations, and currently, trivalent chromium decorative chrome plating is becoming more common. However, conventional trivalent chromium plating tends to have a blackish tint on the coating, which poses challenges in appearance. Our company has newly developed a trivalent chromium plating solution that achieves a beautiful bluish-white appearance comparable to hexavalent chromium plating, with excellent uniform electrodeposition and adherence.

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Long-life, high-speed electroless nickel plating solution

Environmentally friendly electroless nickel plating solution that can be continuously used with stable performance.

Electroless nickel plating, which has a uniform coating thickness, high dimensional accuracy, high hardness, and excellent corrosion resistance, has seen increasing demand in various fields in recent years. Generally, electroless nickel-phosphorus plating experiences a decrease in deposition rate due to the aging of the plating bath. Because changes in the deposition rate can lead to fluctuations in the phosphorus content of the plating film, the plating solution has been regularly updated and discarded. Our company has newly developed an environmentally friendly electroless nickel plating solution that maintains excellent bath stability, showing minimal decrease in deposition rate even after processing for over 10 turns, allowing for continuous use.

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