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  1. Umicore Japan K.K. Tokyo//Ferrous/Non-ferrous metals
  2. ムラタ Hyogo//Chemical
  3. Daiwa Fine Chemicals Co., Ltd. Hyogo//Other manufacturing
  4. 4 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  5. 5 null/null
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  1. Nickel Sulfamate Concentrate Solution "SN Conc 185" - 65% High Concentration Product ムラタ
  2. Nickel plating related chemicals for sulfamic acid ムラタ
  3. ARGUNA C-100 // Graphite Composite Silver Plating Solution Umicore Japan K.K.
  4. 4 PALLUNA ACF-100 // Pd-Ni alloy plating solution Umicore Japan K.K.
  5. 5 Rhodium-Platinum Alloy Plating Solution Umicore Japan K.K.

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"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 2-1

"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 2-1

Progress in the Development of Non-Cyanide Silver Plating Solution 1

■Safe and Secure Silver Plating Currently, the mainstream silver plating used in industrial applications is cyanide plating baths, which were invented in 1838 by G.R. Elkington in the UK. Since then, cyanide compounds have been used for about 180 years and are still widely utilized today. This is because cyanide forms very stable complexes with many metals and can create dense and uniform coatings, making it not only used for silver plating but also for zinc plating, copper plating, and gold plating for a long time. However, the strong toxicity of cyanide poses many issues regarding occupational safety and wastewater treatment, leading to the early development of "non-cyanide plating solutions" in the plating industry. *For more details, please refer to the related links below.*

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[Safe and Secure] Non-Cyanide Silver Plating Solution "Dine Silver" 3-2

[Safe and Secure] Non-Cyanide Silver Plating Solution "Dine Silver" 3-2

Features of "Dine Silver" that are friendly to people and the Earth 2

Using non-cyanide silver plating solutions that exceed cyanide without using cyanide The non-cyanide silver plating solution has been developed with the perspective of being equivalent to cyanide baths, but now it adds performance not found in cyanide baths, improving economic efficiency and convenience. ● It has good long-term stability, and there is no need to renew the bath due to the accumulation of carbonates seen in cyanide baths. ● For copper-based materials, good adhesion can be achieved even without a strike silver plating. ● It can be operated over a wide pH range (3 to 10). Plating is possible on materials coated with resist films that are susceptible to alkalis. ● Various plating methods such as rack plating, barrel plating, and continuous plating can be applied. ● A uniform white matte or semi-gloss silver plating can be obtained. ● Properties such as solderability, contact electrical resistance, and hardness are equivalent to those of cyanide baths. *Continued from "Basic Information"*

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"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 4

"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 4

Characteristics, Uses, and Lineup of "Dain Silver"

■Characteristics of Non-Cyan Silver Plating Solution "Dine Silver" ● High safety due to the complete absence of cyanide compounds, making wastewater treatment easy. ● A non-alkaline type compatible with resist substrates is available. ● Reduction of production processes is possible. A type that does not require stripe plating is also available. ● Coating characteristics and bath application conditions are equivalent to cyan silver plating; silver anode use is acceptable. ■Compatible with Various Applications Supports rack, barrel, hoop, electroforming, pulse, and jet plating. Compatible with semiconductor lead frames and other electronic component plating. *For more details, please refer to the related links and catalog below.

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Replacement zinc plating bath "See You Guard SN-3"

Replacement zinc plating bath "See You Guard SN-3"

Ideal for electroless tin plating on fine copper wiring patterns. Thickening up to several micrometers is also possible.

"See You Guard SN-3" is an electroless, replacement-type tin plating bath that allows for the formation of a uniform tin plating film simply by immersing copper materials. It is compatible with fine wiring. 【Features】 ■ Thick films of up to several micrometers can be achieved. ■ A dense film can be formed. ■ Due to the minimal impact of agitation, plating can be done uniformly on complex shapes. ■ Usable over a wide temperature range. *For more details, please refer to the PDF materials or feel free to contact us.

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【Safety, Security, Environmental Impact Reduction】Non-Cyanide Silver Plating Solution

【Safety, Security, Environmental Impact Reduction】Non-Cyanide Silver Plating Solution

Non-cyanide silver plating solution "Dine Silver Series"

The Dain Silver Series is an environmentally friendly non-cyanide silver plating process. 【Features of the Dain Silver GPE Process】 - Strongly acidic type plating solution - Silver plating possible on resist pattern substrates - Good adhesion of silver plating on various SUS materials and over nickel - A wide range of appearances including matte, semi-gloss, and glossy 【Features of New Products】 "Dain Silver BPL (Matte)" "Dain Silver HKR (Glossy)" - Weakly alkaline type plating solution - Improved heat resistance (suppression of copper diffusion in the substrate) - Good coverage properties We will propose the optimal process according to your application.

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