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This is a neutral tin plating process for barrels with low foaming and a pH of 7.
■ DAIN TINGOOD 314 bath has a pH of 7, so it does not damage materials such as ceramic chips. ■ It has almost zero foaming and excellent plating workability. ■ It suppresses the generation of precipitates from tetravalent tin and has excellent bath stability.
DAIN TINGOOD 105 is an additive for high-speed organic acid tin plating. It offers excellent reflow properties and is suitable for high-speed plating on wires and other materials!
■ Compatible with high-speed organic acid tin plating ■ Good reflow characteristics
DAIN TINGOOD 207 is an organic acid bath designed for high-speed plating, providing a glossy tin plating solution. It results in a uniformly glossy appearance on the surface.
■ Organic acid, high-speed plating compatible glossy tin plating bath ■ Standard composition (Sn2+: 45 g/L), at 25 °C and around 12 A/dm2, a uniform glossy appearance of the coating can be obtained. ■ Compared to typical tin plating baths, it has lower foaming, which improves workability.
From matte to high gloss, from acidic to alkaline! There is a wide range of options available!
The non-cyanide silver plating proposed by Yamato Kasei is entirely cyan-free and of the non-cyanide type. We offer a wide range of options from matte to high gloss, allowing you to choose according to your application. 【Acidic】 "Dine Silver GPE" Series - Direct plating on resist patterns is possible without dissolving the resist. Matte: Dine Silver GPE-PL Semi-gloss: Dine Silver GPE-SB Gloss: Dine Silver GPE-HB High gloss: Dine Silver GPE-HB2 【Neutral】 "Dine Silver AG-PL30, Dine Silver Bright PL50" - Direct silver plating on copper and copper alloys is possible. Matte: Dine Silver AG-PL30 Gloss: Dine Silver Bright PL50 【Alkaline】 "Dine Silver BPL, Dine Silver HKR" - Excellent uniform electrodeposition, stability, and heat discoloration resistance. Matte: Dine Silver BPL Gloss: Dine Silver HKR *For more details, please refer to the related links below.
Cyan Cu Strike Plating Alternative 'DAIN COPPER PSR-SZ'
- Non-cyanide strike Cu plating as an alternative to cyanide Cu strike plating - No copper replacement deposition occurs on zinc die-cast materials, forming a well-adhered plating film - Weakly acidic to neutral plating solution - Monovalent copper type (colorless and transparent) similar to cyanide baths
Low-temperature mounting is possible for weak heat-resistant materials such as PET.
By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - The Bi content (20-60 wt%) can be controlled by changing the usage conditions. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】Dainting Alloy I - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.
Non-cyanide Cu strike plating for zinc die casting, Ni-free compatible Cu-Sn alloy plating.
【Cyan Cu Strike Plating Alternative 'DAIN COPPER PSR-SZ'】 - Non-cyanide strike Cu plating alternative to cyan Cu strike plating - No copper replacement precipitation occurs on zinc die-cast materials, forming a well-adhered plating film - Weakly acidic to neutral plating solution - Monovalent copper type (colorless and transparent), same as cyan bath 【Ni-Free Copper-Tin Alloy Plating 'Dain Specular'】 - Uniform film composition and silver-white high gloss appearance across a wide current density - Acidic plating solution - Thick plating possible (5μm) - Compatible with rack plating, hoop plating, and barrel plating - Proven track record in mass production for decorative applications
Silver plating can be formed by immersion without the need for an external power source.
◆Replacement Type (Dine Silver EL Process) - A silver plating film with good adhesion can be deposited on Cu and electroless Ni-P. - The bath life is long at 3 turns, with good stability over time. - It is an acidic plating process that can accommodate surface treatment of registry substrates. - Thick films of 0.5μm or more can be achieved. ◆Reduction Type (Dine Silver RD Process) - Can be deposited on non-conductive materials (resin, glass, etc.) with a catalyst applied. - A silver plating film of approximately 0.5μm can be formed in 1 hour. - Usable at temperatures below 60°C.
New lineup of non-cyan silver plating.
This product is a completely cyan-free type of silver alloy plating that is environmentally friendly and safe for humans. For electric vehicle (EV) charging connectors, it is necessary to carry a large current to shorten charging time, which requires a metal plating coating with excellent wear resistance. This product has a contact electrical resistance comparable to that of pure silver plating and provides a silver-antimony alloy plating coating (Sb = 1-2%) with excellent wear resistance and a hardness of over 150 Hv (measured value around 180 Hv). Therefore, it can be applied to various contacts and switch components, including EV charging connectors.
No external power supply is needed; a silver plating film can be formed by immersion!
【Self-Catalytic (Reduction) Silver Plating: Dain Silver RD2】 - Can be deposited on non-conductive substrates (resin, glass, etc.) with the addition of a catalyst. - A silver plating film of approximately 0.5μm can be formed in 1 hour. - Usable at temperatures below 60°C. 【Replacement Type Silver Plating: Dain Silver EL Series】 - A silver plating film with good adhesion can be deposited on Cu and electroless Ni-P. - The bath life is long at 3 turns, with good stability over time. - Compatible with acidic plating processes for surface treatment of resist substrates. - Thick films of 0.5μm or more are possible, increasing productivity! ■ Cost reduction for gold-plated substrates such as ENIG is possible.
Low-temperature mounting on weak heat-resistant materials such as PET is possible.
By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. Plating allows for implementation on patterns and small components. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - By changing the usage conditions, the Bi content (20-60 wt%) can be controlled. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】DAINTINGOOD 511 - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.
There is a track record of mass production using nickel alternatives for gold plating substrates.
【Features】 - When used as a base for gold plating, it suppresses corrosion compared to using nickel plating as a base. - It is a non-cyanide sulfuric acid bath. - A uniform glossy appearance can be achieved over a wide range of current densities. - Thick films are possible. - Compatible with rack plating, barrel plating, and hoop plating.
Perform plating through chemical reactions without using electricity.
Electroless plating refers to a plating method that deposits metal ions from the plating solution onto the surface of a material through a chemical reaction without using a direct current power supply. Advantages of electroless plating: - High uniformity of film thickness can be achieved simply by immersing the material in the plating solution. - Plating is possible on non-conductors such as plastics and ceramics. - Large quantities can be processed at once. At Daiwa Kasei, we offer the following lineup of electroless silver plating solutions. <Electroless Silver Plating> 【Replacement Type】Dain Silver EL Process - Good adhesion of silver plating is possible on copper or electroless nickel-phosphorus. - It is an acidic plating solution, making it ideal for surface treatment of resist substrates. - The bath life is long, exceeding 3 turns, and it has excellent stability over time. 【Reduction Type】Dain Silver RD Process - Silver plating is possible on non-conductors (resins, glass, etc.) that have been treated with a catalyst. - A silver plating film of approximately 0.5 to 1 mm can be formed in one hour. - It can be used at temperatures below 60°C.
Zinc die casting no cyan copper plating process.
"DAIN COPPER PSR-SZ" is the industry's first thickly applicable non-cyanide copper plating solution that uses monovalent copper ions. Due to the inclusion of a special complexing agent, there is no substitution with the substrate at all, and the electrodeposited film shows excellent adhesion. It has made it possible to perform non-cyanide copper plating on zinc die-cast materials, which has been difficult until now.
Supports silver plating on patterned wafers and high-frequency substrates.
This is a silver plating that meets even higher film property requirements than conventional products. 【Dain Silver GPE-FR1】 - Low stress type - High current specification - Maintains a smooth semi-gloss appearance even after thick film application 【Dain Silver GPE-FR2】 - Excellent heat discoloration resistance (suppresses diffusion of underlying Cu) - Good film thickness uniformity - Forms a high purity Ag film of 99.99% or more
