Ozzik Technologies' "Electroless Ag Plating" is compatible with SiC power devices! It achieves excellent performance.
A simple explanation of nickel plating, zinc plating, and plastic plating in manga!
Even though we talk about plating, there are various types of plating processes.
Depending on the required application, environment, and the material being processed, it can be confusing to determine which plating process is best.
"Electroless Ag Plating" is a technology from Ozic Technologies that is compatible with SiC power devices.
Conventional technologies have issues such as instability in operation under high-temperature environments and an inability to meet the demands for high-performance devices, necessitating more advanced processing to accommodate SiC power devices.
Our "Electroless Ag Plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles.
【Features】
■ Achieves excellent performance as an Au alternative plating such as DIG (Direct Immersion Gold)
■ Maintains quality for a long time without being affected by the substrate (such as Cu) and without oxidation
■ Forms a uniform thin film (0.1~0.5μmt), accommodating fine wiring patterns and partial plating
*For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Surface Treatment 'Niporin'](https://image.mono.ipros.com/public/product/image/d88/2000424152/IPROS23381335667271948341.jpeg?w=280&h=280)
