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Polishing Machine Product List and Ranking from 248 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. 田中インポートグループ Osaka//others
  4. 4 null/null
  5. 5 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
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Polishing Machine Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  3. Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide. フジミインコーポレーテッド
  4. 4 Tabletop small sample mirror polishing machine "DIALAP V.A" [Made in Japan]
  5. 5 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460 西田機械工作所

Polishing Machine Product List

706～720 item / All 814 items

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Dry Electrolytic Polishing Device DLyte 100

Dry Electrolytic Polishing Device DLyte 100

Achieving high-quality polishing that preserves the edge through mechanization.

Medium-sized series of the dry electrolysis polishing device DLyte. "DLyte" is a polishing device that uses patented technology for grinding and polishing metals through ion exchange with granular resin media that contains electrolytes. Since it is a process where material is removed from the peak parts of surface roughness, edges do not become rounded, allowing for polishing of complex shapes that were difficult with conventional methods. The DLyte 100PRO is designed to handle a wide range of materials, including steel, cobalt-chromium, titanium, copper-based, nickel-based, and aluminum. 1) Supports polishing of various metals including cobalt-chromium and titanium. 2) Environmentally friendly and easy disposal of media. 3) General medical device registered model available. 4) Also offers small and large models in the lineup.

  • Wafer processing/polishing equipment

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Dry Electrolytic Polishing Device DLyte PRO500

Dry Electrolytic Polishing Device DLyte PRO500

Achieving high-quality polishing that retains the edge through mechanization.

Large series of the dry electrolysis polishing device DLyte. "DLyte" is a polishing device that uses patented technology to perform grinding and polishing of metals through ion exchange with granular resin media that contains electrolytes. It enables automation from grinding to mirror finishing, and because it is a process that removes material from the peak areas of surface roughness, it does not round edges and can polish complex shapes that were difficult with conventional methods. 1) Easy operation with parameters for different materials 2) No dust generation, easy waste disposal, and a safe and secure polishing device 3) Compatible with automation using AGVs and robotic arms 4) Lineup includes small and medium models

  • Wafer processing/polishing equipment

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Medium-sized 6-axis center swing Oscar grinding machine NMO-6P-3

Medium-sized 6-axis center swing Oscar grinding machine NMO-6P-3

The central swing Oscar structure enables stable polishing.

It is a device that is easy to use and user-friendly, thanks to the display and control of each axis in the electrical system.

  • Other processing machines
  • Other processing machines

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Small 5-axis upper shaft ball core grinding machine UP-5P-15

Small 5-axis upper shaft ball core grinding machine UP-5P-15

High-precision polishing of deep concave lenses for small paths is possible.

It is a 5-axis pellet machine specialized in the manufacturing of small-diameter lenses.

  • Other processing machines

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Medium-sized 4-axis upper ball core grinding machine UP-4P-50

Medium-sized 4-axis upper ball core grinding machine UP-4P-50

By pressurizing and oscillating the ball core, it is possible to polish deep concave lenses with high precision.

This is a polishing machine with a maximum tool diameter of Φ100mm, developed with a unique design for upper axis ball core oscillation.

  • Other processing machines
  • Other processing machines

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Medium-sized 3D Type Polishing Machine NMU-2P

Medium-sized 3D Type Polishing Machine NMU-2P

Capable of high-precision polishing of wide lenses.

This is a device with extremely high rigidity due to the lower axis position adjustment mechanism. It can process a wide range of workpiece shapes with high precision.

  • Other processing machines

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Small Path High-Speed Ball Grinding Machine HPS-50H

Small Path High-Speed Ball Grinding Machine HPS-50H

High precision and stable finish.

It is a high-performance compact spherical grinding machine with a processing axis that precisely oscillates the spherical core.

  • Other processing machines

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Fluid polishing device

Fluid polishing device

- By mixing abrasive particles with the medium and discharging it, the inner walls of the water pipe are "polished." - Even complex water pipes can be polished.

This is a device that "polishes" the inner wall of water pipes by repeatedly reciprocating a medium containing abrasive particles under high pressure (up to 2.5 MPa on the work side safety valve). Fluid Polishing Device KMM - Power: Hydraulic pump - Voltage: AC200 50/60Hz 3-phase - Apparent power: 3.7 kVA - Pressure: 1.5 MPa - Tank capacity: 1.5L x 2 - Abrasive: Alumina - Flow rate change: Example: during shaping 1.5L/min → 2.5L/min - Processing purpose: Rust removal and polishing of water pipes - Target parts: Water pipes of molds in general, parts and devices with water pipes - External dimensions (mm): W580 × D902 × H1304 (Piping part: 91, Patrol light: 158) - Weight: 235 kg

  • Contract manufacturing

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Processing machinery - Grinding machine

Processing machinery - Grinding machine

Leave it to us for polishing machines!

Our company develops and manufactures ultra-precision processing machines, and we handle "grinding machines" as processing equipment. We offer a range of machines including ultra-large double-sided lapping machines, optical grinding machines, and oscillating single-sided grinding machines. Please feel free to contact us if you have any inquiries. 【Product Lineup】 ■ Ultra-large double-sided lapping machine: MODEL TDX-48B ■ Optical grinding machine: MODEL TOP-1200 ■ Oscillating single-sided grinding machine: MODEL TSOP-600 *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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One company provides comprehensive support for grinding processes (internal diameter grinding, external diameter grinding, and flat grinding)!

One company provides comprehensive support for grinding processes (internal diameter grinding, external diameter grinding, and flat grinding)!

The world of grinding requires precision at the 1μ level! Reducing costs such as labor expenses for transportation to external suppliers.

Our company is equipped with internal grinding machines for inner diameter polishing, cylindrical grinding machines for outer diameter polishing, and surface grinding machines for flat surface polishing, allowing us to perform internal, external, and flat polishing consistently in-house. We achieve short delivery times through integrated processing. By not outsourcing, we maintain our technical standards and ensure stable quality assurance. Furthermore, we have skilled workers with over 10 years of experience, and we pass on their expertise to the younger generation, enabling us to carry out integrated production in-house. 【Features】 - Achieves short delivery times through integrated processing - Reduces costs associated with labor for transportation to outsourcing partners - Maintains our technical standards and ensures stable quality assurance by not outsourcing - Capable of performing internal, external, and flat polishing consistently in-house - Employs skilled workers with over 10 years of experience *For more details, please refer to the related link page or feel free to contact us.

  • Processing Contract

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Round Blade Grinder LA300 (Manufactured by MVM) [Short Delivery Time]

Round Blade Grinder LA300 (Manufactured by MVM) [Short Delivery Time]

A 'reasonable' sharpening machine for re-sharpening slitter knives!

The "LA300" is a grinding machine designed for sharpening slitter knives (upper and lower blades). This practical, convenient, and compact machine is easy to use and can grind up to an outer diameter of 300mm. Additionally, it uses a 1.5kW motor with automatic feed and allows for angle settings from 0 degrees to 70 degrees. 【Specifications】 ■ Grinding stone motor power: 1.5kW ■ Grinding stone outer diameter: 127mm ■ Table rotation speed: 3 to 35rpm ■ Maximum grindable outer diameter: 300mm ■ Machine size: 700x500x1500mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Round blade grinding machine / grinding machine with rotating table LA500 (manufactured by MVM)

Round blade grinding machine / grinding machine with rotating table LA500 (manufactured by MVM)

A 'reasonable' grinding machine for sharpening slitter knives of various shapes!

The "LA500" is a very versatile, unique, and user-friendly grinding machine. It features a very sturdy and high-rigidity base, and thanks to its excellent weight distribution, it operates without vibration, allowing for high-quality finishing grinding. Additionally, we also offer a version called "LA700" for grinding circular blades and discs with a diameter of up to 700mm. 【Specifications】 ■ Grinding wheel motor power: 2.2-3.7kW ■ Grinding wheel inner diameter: 150mm ■ Outer diameter of the central hole of the grinding wheel: 20mm ■ Variable speed of the rotating table: 3-35rpm ■ Diameter of the magnetic table: 300-350-400mm ■ Outer diameter of the magnetic chuck: 25mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Ultrasonic Polishing Device "LAPTRONμ"

Ultrasonic Polishing Device "LAPTRONμ"

Ultrasonic polishing device suitable for processing the corners of discharge targets!

"LAPTRONμ" is an ultrasonic polishing device that features the smallest diameter in the series at Φ20mm for the ultrasonic hand tool and a Φ5mm chuck. It can be used not only with ceramics and wood chips + paste but also with metal bond diamond chips. It is particularly suitable for processing corners of discharge surfaces that are prone to unevenness and for product shapes that are less than 1mm. 【Specifications】 ■ Size and Weight ・ Main Unit: W236×D160×H105 (mm) / Approx. 2.3kg ・ Hand Tool: Φ20×L120 (mm) / Approx. 57g ■ Input: AC100V 50/60HZ ■ Output: Maximum 13W, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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"Super Eight Finisher" - 8-Shape Full Flow Barrel Polishing Machine

"Super Eight Finisher" - 8-Shape Full Flow Barrel Polishing Machine

Achieving efficient polishing with an 8-shaped centrifugal surface flow type.

The "Super Eight Finisher" is a fully flowing high-speed barrel polishing machine that processes various materials uniformly through an "8-shaped motion." It can be used for materials other than metal, such as resin-based works, which are prone to cracking and deformation in conventional barrel polishing machines. Additionally, it can simultaneously process different applications and workpieces, allowing for a large quantity of workpieces to be processed at once. 【Features】 ■ The "8-shaped" flow created by rotation and revolution allows for smooth and uniform finishing in a short time. ■ Wide adaptability regardless of shape or material. ■ Suitable for high-speed automatic polishing of a variety of small lots with a four-tank system. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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