Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide.
Fujimi / Forms a thermal conduction path with a high aspect ratio, improving thermal conductivity for TIMs and more! The rounded surface ensures good filling properties for resins and other materials.
In recent years, the high functionality of communication and mobility has led to issues with heat generation in electronic devices, increasing expectations for heat dissipation materials. Zinc oxide, like common alumina (aluminum oxide) and magnesia (magnesium oxide), has high thermal conductivity and possesses the following advantages: - Low Mohs hardness, resulting in low aggressiveness towards equipment used to manufacture heat dissipation materials - Low thermal expansion coefficient, leading to minimal impact on dimensional changes of heat dissipation materials - Superior water resistance compared to magnesia Our company has successfully developed rod-shaped zinc oxide using our unique particle synthesis technology. Rod-shaped zinc oxide is expected to have three effective benefits for heat dissipation materials: 1) Its high aspect ratio makes it easy to form thermal conduction paths 2) Its rounded corners, due to the crystal structure, make it easy to fill into resins and other materials 3) It is easier to secure contact surface area between fillers compared to spherical particles If you have any of the following challenges, please feel free to contact us: - You want to try heat dissipation/thermal conduction fillers with unique shapes - You are struggling with the difficulty of filling boron nitride fillers (to be combined as a bulking filler) - You are facing issues with water resistance measures for aluminum nitride
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
![Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!](https://image.mono.ipros.com/public/product/image/ae6/2001507285/IPROS11039745654635322290.jpg?w=280&h=280)
