Notice of Participation in Nanotech 2026 (January 28-30)

It combines high thermal conductivity and chemical stability, with excellent fillability and fluidity in a rounded shape.

"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.

• Ceramics

Achieving high hardness equivalent to HRA92 with a 3D printer! Introducing a molded body made using newly developed WC-TiC-Co based powder for additive manufacturing.

Until now, our high-hardness powder for 3D printers has had a hardness limit of around 87HRA for the molded body, which posed challenges in applications for parts made from some ultra-hard alloys due to insufficient hardness. The newly developed hard powder has a main phase of WC-TiC-Co, and by achieving a fine microstructure, we have significantly improved the hardness of the molded body to 92HRA. This enables 3D printing of ultra-hard alloy powders that require high hardness, contributing to the resolution of conventional challenges. **Expected Applications** - High-precision press molds (extended lifespan and stabilized precision) - Special cutting tools (high wear resistance and high reliability) - Prototype manufacturing (shortened delivery times) Furthermore, since we possess metal 3D printer equipment, we can provide a comprehensive service that goes beyond mere powder sales, including ultra-hard molding tests, material property evaluations, and prototype support. For customers looking for "ultra-hard alloy 3D printing," "hard powder for metal 3D printers," or "ultra-hard powder materials," we offer a total solution that combines materials, molding, and evaluation. Please feel free to contact us for inquiries about the introduction of next-generation ultra-hard alloy 3D printing or prototype consultations.

• Ceramics
• 3D Printer

Fujimi / Forms a thermal conduction path with a high aspect ratio, improving thermal conductivity for TIMs and more! The rounded surface ensures good filling properties for resins and other materials.

In recent years, the high functionality of communication and mobility has led to issues with heat generation in electronic devices, increasing expectations for heat dissipation materials. Zinc oxide, like common alumina (aluminum oxide) and magnesia (magnesium oxide), has high thermal conductivity and possesses the following advantages: - Low Mohs hardness, resulting in low aggressiveness towards equipment used to manufacture heat dissipation materials - Low thermal expansion coefficient, leading to minimal impact on dimensional changes of heat dissipation materials - Superior water resistance compared to magnesia Our company has successfully developed rod-shaped zinc oxide using our unique particle synthesis technology. Rod-shaped zinc oxide is expected to have three effective benefits for heat dissipation materials: 1) Its high aspect ratio makes it easy to form thermal conduction paths 2) Its rounded corners, due to the crystal structure, make it easy to fill into resins and other materials 3) It is easier to secure contact surface area between fillers compared to spherical particles If you have any of the following challenges, please feel free to contact us: - You want to try heat dissipation/thermal conduction fillers with unique shapes - You are struggling with the difficulty of filling boron nitride fillers (to be combined as a bulking filler) - You are facing issues with water resistance measures for aluminum nitride

• plastic

[Low-temperature sintering, high densification, high purity] SiC ultrafine particles with an average particle diameter of 250nm contribute to the densification of the sintered body!

SiC (silicon carbide) sintered bodies are widely used in semiconductor manufacturing equipment and other applications due to their excellent properties such as chemical resistance, heat resistance, and high thermal conductivity. In recent years, with the advancement of product requirements, there has been a demand for higher density in sintered body components. However, since SiC is a difficult-to-sinter material, producing high-density SiC sintered bodies poses challenges, such as the need for temperature environments around 2000°C, which places a high load on equipment. In response to these challenges, our company has developed α-type silicon carbide, GC#40000. This product consists of ultra-fine particles with an average particle diameter of 250 nm, allowing for higher activation energy during sintering, which enables sintering at lower temperatures than conventional methods. Additionally, under the same temperature conditions, it is possible to achieve a denser and more compact sintered body. Furthermore, GC#40000 achieves a high purity of 99.9% as α-type SiC, contributing to the production of high-purity sintered bodies. If you have any of the following challenges, please feel free to contact us: - I want to improve the density of sintered bodies. - I want to reduce the firing temperature to decrease the power consumption of the firing furnace. - I want to sinter SiC in the current firing furnace, but the maximum temperature of the furnace is insufficient.

• Fine Ceramics

Particles of titanium phosphate contribute to "improved anti-seizing properties" and "extended lubrication performance" when added to solid lubricants such as grease!

In recent years, to reduce the emissions of PFAS, which are difficult to decompose and have the potential for long-term environmental persistence, regulations are being considered in Europe. This has narrowed the options for materials in the solid lubricant industry, and alternatives to PTFE are limited. In response to such challenges, we have developed titanium phosphate in a plate-like form with a controlled aspect ratio. Our synthesis technology allows for control of particle sizes from 0.3 to 5 µm, providing uniform plate-like particles. Plate-like titanium phosphate has the following three characteristics for solid lubricant applications: 1) Excellent sliding properties due to the shape characteristics of the plate-like particles. 2) High whiteness, which prevents black contamination of the surroundings. 3) Composed of materials that do not contain fluorine compounds. Our titanium phosphate tends to excel in anti-seizing properties compared to common solid lubricants such as molybdenum disulfide, PTFE, and boron nitride. If you have any of the following challenges, please feel free to contact us: - Want to improve the anti-seizing properties of lubricants. - Want to achieve lubrication performance with a small amount of additive. - Considering measures against PFAS in materials. *For more details, please download the PDF.

• Ceramics

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed