It combines high thermal conductivity and chemical stability, with excellent fillability and fluidity in a rounded shape.
"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.
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【Exhibition Overview】 ■Exhibition Name: 10th Advanced Ceramics Exhibition CERAMIC JAPAN ■Dates: November 12 (Wednesday) to 14 (Friday), 2025 ■Opening Hours: 10:00 AM to 6:00 PM (ends at 5:00 PM on the final day) ■Venue: Makuhari Messe Exhibition Hall 2 ■Booth Number: 9-13 ■Registration is required for entry *For more details, please download the PDF or feel free to contact us.
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【Main Uses and Application Areas】 ■ Products requiring TIM (Thermal Interface Material) or high fluidity - Heat dissipation sheets - Heat dissipation grease - Heat dissipation adhesives - Heat dissipation gap fillers - Sealants, etc. *For more details, please download the PDF or feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.