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  1. Home
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  3. フジミインコーポレーテッド
  4. Notice of Participation in the 10th Ceramics Exhibition (High-Performance Materials WEEK) to be held from November 12 to 14.
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  • Sep 03, 2025
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Sep 03, 2025

Notice of Participation in the 10th Ceramics Exhibition (High-Performance Materials WEEK) to be held from November 12 to 14.

フジミインコーポレーテッド フジミインコーポレーテッド
We will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN," which will be held from November 12 (Wednesday) to 14 (Friday), 2025, at Makuhari Messe (Exhibition Hall 2). Our booth will showcase various functional powders that we are developing. We invite you to visit our booth. ◆ 10th High-Performance Ceramics Exhibition CERAMIC JAPAN ◆ Dates: November 12 (Wednesday) to 14 (Friday), 2025 Opening Hours: 10:00 AM to 6:00 PM (ends at 5:00 PM on the final day) Venue: Makuhari Messe, Exhibition Hall 2 Booth Number: 9-13 Official Website of the High-Performance Ceramics Exhibition: https://www.material-expo.jp/tokyo/ja-jp.html Registration is required for entry to the High-Performance Ceramics Exhibition. Please obtain your visitor badge in advance from the link below and come to the event.
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【NEW】Heat dissipation and thermal conductivity filler - rounded silicon carbide (SiC)

A next-generation thermal conductive filler that combines high thermal conductivity and chemical stability, featuring a rounded shape that excels in fillability and fluidity.

Silicon carbide (SiC) is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. In particular, the rounded SiC filler with beveled edges achieves high fillability and fluidity. It easily disperses uniformly in resins and adhesives, enabling a balance between processability and thermal performance in thermal interface materials (TIM) such as heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, and heat dissipation gap fillers. Furthermore, this rounded shape is expected to reduce stress concentration and contribute to the long-term reliability of components. Applications extend to a wide range of fields where heat management is crucial, including inverters for electric vehicles, onboard power modules, LED substrates, and communication devices. The rounded SiC filler, with its significant potential as a next-generation thermal management material, serves as a powerful solution for development challenges that require both heat dissipation and reliability.

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Heat dissipation and thermal conduction filler, spherical silicon carbide (SiC)

It combines high thermal conductivity and chemical stability, with excellent fillability and fluidity in a rounded shape.

"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.

  • Ceramics

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【NEW】Heat dissipation and thermal conduction filler - rounded silicon carbide (SiC) / contributes to high filling and high fluidity.

【NEW】Heat dissipation and thermal conduction filler - rounded silicon carbide (SiC) / contributes to high filling and high fluidity.

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Electronic Components and Semiconductors
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Slim 4 (Four) 48 W Jacket Tubes

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We would like to introduce 'Slim 4' handled by FCR & Bio Co., Ltd. This product is a jacket tube with a rack lid lock and anti-rotation function (compatible capacity 4.1ml). It is autoclavable and suitable for DMSO and vapor phase of liquid nitrogen. Additionally, it features a screw cap that does not use O-rings, packing, or gaskets. 【Features】 ■ Polypropylene ■ Autoclavable ■ DMSO compatible ■ Suitable for vapor phase of liquid nitrogen *For more details, please download the PDF or feel free to contact us.

Nov 07, 2025

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■■ Sealed Product Air Leak Test Device | MSZ-0701 series ■■ New standard for waterproof testing. "Dry" non-destructive testing that does not wet electronic devices or packaging. Capable of testing the waterproofness of sealed products (equivalent to IPX7, IPX8).

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● To determine the sealing and waterproofing of sealed products based on pressure changes, it is not necessary to conduct tests that involve spraying water on the product or immersing it in water. ● Once the product is placed in a dedicated fixture within the inspection device, waterproofing can be quantitatively confirmed through automatic measurement. ● The target product size is W 300 × D 210 × H 100 mm or smaller. ● The target products include automotive cameras, smartphones, ECUs, small motors, and other packaging containers, and are effective for any products that require confirmation of sealing, waterproofing, and airtightness. ● For product specifications and details, please contact us.

Nov 07, 2025

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■■ The measurement section is made of all stainless steel! General-purpose air leak tester | FLS-0100 series ■■ Designed to meet the strict production line requirements where the use of specific metals is prohibited, such as in electronic component factories and battery factories.

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In battery manufacturing lines, if components containing copper are used, there is a possibility that metal powder may mix in, dissolve, ionize, and pass through the separator, causing a malfunction that connects the positive and negative electrodes. Such minute metal powders may not be detected during pre-shipment inspections, and even if they are found, they can lead to various issues, such as the need to increase inspection processes to detect them. Therefore, Fukuda has developed a copper-free (all stainless steel) air leak tester that can be safely used in the production lines of battery manufacturers and secondary battery manufacturing equipment manufacturers. For product specifications and details, please refer to the "Related Product Information" and "Related Catalogs" below.

Nov 07, 2025

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■■ Vial Leak Testing Device | MSQ-2002 series ■■ The definitive non-destructive testing alternative to "submersion testing" for pharmaceutical packaging (various vials, bottles, eye drops, cylindrical containers, etc.). Complies with vial integrity testing (JP18, USP <1207>).

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Introducing a "non-destructive testing device as an alternative to the submerged test" for pharmaceutical packaging products. "Complete vial leak testing device | MSQ-2002 series" Fully automating leak tests for various vials, bottles, eye drops, and cylindrical containers. Please check the link below for videos and catalogs.

Nov 07, 2025

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We will enhance the awareness of young employees and increase the retention rate!

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For companies struggling with the retention rate of young employees in their 2nd to 3rd year This training focuses on growth and success experiences in professional life, aiming to enhance self-efficacy. At the same time, we will work on mindset to address anxieties, dissatisfaction, and frustrations, motivating participants to apply these insights to their future lives and work. Additionally, we will help them clarify their aspirations and action plans as senior employees, fostering self-awareness and increasing motivation. For more details, please refer to the product information.

Nov 07, 2025

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