【NEW】Heat dissipation and thermal conductivity filler - rounded silicon carbide (SiC)

A next-generation thermal conductive filler that combines high thermal conductivity and chemical stability, featuring a rounded shape that excels in fillability and fluidity.

Silicon carbide (SiC) is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. In particular, the rounded SiC filler with beveled edges achieves high fillability and fluidity. It easily disperses uniformly in resins and adhesives, enabling a balance between processability and thermal performance in thermal interface materials (TIM) such as heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, and heat dissipation gap fillers. Furthermore, this rounded shape is expected to reduce stress concentration and contribute to the long-term reliability of components. Applications extend to a wide range of fields where heat management is crucial, including inverters for electric vehicles, onboard power modules, LED substrates, and communication devices. The rounded SiC filler, with its significant potential as a next-generation thermal management material, serves as a powerful solution for development challenges that require both heat dissipation and reliability.

Ceramics