[Low-temperature sintering, high densification, high purity] SiC ultrafine particles with an average particle diameter of 250nm contribute to the densification of the sintered body!
SiC (silicon carbide) sintered bodies are widely used in semiconductor manufacturing equipment and other applications due to their excellent properties such as chemical resistance, heat resistance, and high thermal conductivity. In recent years, with the advancement of product requirements, there has been a demand for higher density in sintered body components. However, since SiC is a difficult-to-sinter material, producing high-density SiC sintered bodies poses challenges, such as the need for temperature environments around 2000°C, which places a high load on equipment. In response to these challenges, our company has developed α-type silicon carbide, GC#40000. This product consists of ultra-fine particles with an average particle diameter of 250 nm, allowing for higher activation energy during sintering, which enables sintering at lower temperatures than conventional methods. Additionally, under the same temperature conditions, it is possible to achieve a denser and more compact sintered body. Furthermore, GC#40000 achieves a high purity of 99.9% as α-type SiC, contributing to the production of high-purity sintered bodies. If you have any of the following challenges, please feel free to contact us: - I want to improve the density of sintered bodies. - I want to reduce the firing temperature to decrease the power consumption of the firing furnace. - I want to sinter SiC in the current firing furnace, but the maximum temperature of the furnace is insufficient.
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【Examples of Use】 - Industrial machine parts (mechanical seals, structural components, heaters, etc.) - Semiconductor manufacturing equipment parts (process tubes, etc.) *Please refer to the catalog for product details.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
