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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  3. アイエムティー Wakayama//Testing, Analysis and Measurement
  4. 4 null/null
  5. 5 チップトン Aichi//Manufacturing and processing contract

Polishing machine Product ranking

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  3. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  4. 4 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460 西田機械工作所
  5. 5 Magnetic Fluid Grinding (MRF) Device QED Technologies International, Inc.

Polishing machine Product List

211~225 item / All 811 items

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Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

We are performing high-precision polishing of micron plates using a double-sided polishing machine!

We perform high-precision polishing of micron plates using a double-sided polishing machine. We also handle mass production polishing and lapping of difficult-to-cut materials such as iron and Kovar, as well as non-magnetic materials like copper, aluminum, SUS, titanium, and resin. Please contact us for more details.

  • Processing Contract

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Surface grinding processing using a horizontal axis rotary grinding machine

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

The 'Surface Grinding Process Using a Horizontal Axis Rotary Grinding Machine' involves grinding the reference surfaces, specifically the end faces and both end surfaces, as the first step when high-precision machining of flanged round objects is required. The reference end face, when processed using a magnetic chuck, is a crucial point to ensure that no deformation occurs during cylindrical grinding and internal grinding due to clamping with chucks and other fixtures. Additionally, the NC horizontal axis rotary grinding machine is suitable for high-precision machining of round objects and can also perform grinding with a taper of a few microns to facilitate easy assembly of the items. Recently, it has shown particular effectiveness in machining titanium materials, contributing to reduced processing time and improved precision for this difficult-to-cut material. [Features] - Materials: S45C, SUS304, A7075, SKD11, Titanium 64, etc. - Industries: Automotive parts prototyping, machine tool parts, semiconductor manufacturing equipment parts, etc. - Processing Machine: NC horizontal axis rotary grinding machine - Processing Accuracy: Flatness and parallelism of 0.001 to 0.005 - Work Size: Φ500×200L *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other machine elements
  • Wafer processing/polishing equipment

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Syringe grinding device

Are you having trouble with thin needles or finishing precision?

Our needle polishing machine may be able to meet your needs. We will customize the basic unit to your specifications. The standard machine accommodates needle sizes from 33G to 14G. Please feel free to consult us regarding other specifications or special needles.

  • Other processing machines

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grinder

A device that can sharpen any needle! Developed and manufactured with the aim of creating a product that anyone can handle with the ease of an automatic machine.

We would like to introduce our "Grinding Machine" that we manufacture. To accommodate the grinding of a wide variety of injection needles, it can handle single-point (single-edged needles) and double-point (double-edged needles) options, and it is capable of grinding any blade shape with a bevel angle ranging from 9 to 40 degrees. Additionally, we offer a lineup of equipment configurations that allow for side hole processing to be performed inline, including punch processing and EMG processing. 【Specifications (Partial)】 ■ General: Fully automatic control of grinding conditions ■ Grinding Chuck: 480mm long ■ Compatible Gauge: 13G (φ2.2) to 32G (φ0.23) ■ Needle Length: 12.5mm to 120.0mm (80-120mm is optional) ■ Grinding Angle: 9-40 degrees *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines
  • Mechanical Design

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Color Filter Full Surface Polishing Device [Correction of Protrusions & Improvement of RGB Surface Flatness]

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

  • Wafer processing/polishing equipment

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Tape-type centerless ultra-finish grinding machine CLP-300

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

  • Wafer processing/polishing equipment

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Stamping Back Surface Polishing Device

Can be processed under suitable conditions! Even beginners can operate it easily.

The "Stamping Back Surface Polishing Device" can polish the back surface of a stamper using a wrapping film. The clamping (fixing) and unclamping (removal) of the workpiece is performed by the operator, while roll polishing, pad polishing, brush cleaning, and air blowing are done automatically. Various surface roughness requirements from different companies can be accommodated by selecting the appropriate wrapping tape and adjusting the parameters of the device to enable processing under optimal conditions. 【Features】 ■ It is possible to randomize the circumference of roll polishing with pad polishing. ■ Once the conditions are set, even beginners can operate it easily. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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Spherical Polishing Device

Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.

This product is a device designed to improve the surface roughness of spherical parts using a tape polishing machine. The supply to the in-machine jig is performed by the operator, and the processing is done automatically via a start switch, making it a semi-automatic machine from which the operator retrieves the finished product. Additionally, the width of the polishing film can be selected based on the workpiece, enabling high efficiency and low-cost processing. 【Features】 ■ Capable of controlling roughness below Ra0.1μm ■ The width of the polishing film can be selected based on the workpiece ■ Achieves high efficiency and low-cost processing ■ Partial R polishing is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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Camwrap device

A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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基板平面研磨装置『FCMP-IIシリーズ』

装置の管理も簡単!ウエット・ドライの両用で使用可能です!

『FCMP-IIシリーズ』は、ラッピングテープの特徴を最大限に生かし、 目的とする研磨が容易に得られ、装置の管理も簡単な基板平面研磨装置です。 ウエット・ドライの両用で使用可能。 一度セットアップすると誰でも簡単に使用出来ます。 メッキ/ラミネート/レジスト塗布の前処理研磨などにご使用いただけます。 【特長】 ■テープ番手の選択にて、粗さの管理が容易 ■ウエット・ドライの両用で使用可能 ■一度セットアップすると誰でも簡単に使用出来る ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Other processing machines
  • Wafer processing/polishing equipment

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Full Surface Grinding (Z-axis Control)

A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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[Presenting Case Studies for Problem Solving] Examples of Installation of Outer Diameter Grinding Equipment

We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!

We would like to introduce a case study proposed by Sanshin Corporation that addresses on-site issues. A certain medical device manufacturer had the concern that "the outer diameter of the pipes used in medical devices has dirt on it after the final process. Since it is for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed." In response, we proposed our "outer diameter polishing device," which allows for the polishing of the workpiece's outer diameter. As a result, by changing the buff polishing process to film polishing, we were able to reduce the cleaning process. This improved the appearance of the finish and contributed to quality enhancement. 【Case Study】 ■ Issues - The outer diameter of the pipes used in medical devices has dirt on it after the final process. - Due to being for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed. ■ Proposal - Introduced the "outer diameter polishing device" that allows for the polishing of the workpiece's outer diameter. - Conducted sample tests, and modifications to specifications according to customer requests are also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives

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[Information] Basic Knowledge of Film Polishing - Introductory Edition

Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.

"Film polishing" is a polishing method that uses a film-like sheet surface called wrapping film, to which fine abrasive particles are adhered. This document serves as an introductory guide to the basic knowledge of film polishing, covering topics such as "What is film polishing?", the "Differences between film polishing and buff polishing," and the "Differences between film polishing and lap grinding." Please take a moment to read through it. [Contents] ■ What is film polishing? ■ What is Sanshin's Super Finisher? ■ Differences between film polishing and buff polishing ■ Differences between film polishing and lap grinding ■ Next time (internal diameter polishing, ball screw polishing, spherical polishing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine tools
  • Wafer processing/polishing equipment

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Robot-type film polishing device *with video*

Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.

- Improvement of surface accuracy in multi-process machining for axis shapes made possible with a single HEAD. - Enhancement of final surface accuracy for end faces of glass, ceramics, resin substrates, etc. - Improvement of surface accuracy for the outer diameter circumference of power semiconductors, silicon wafers, etc.

  • Other semiconductor manufacturing equipment
  • Grinding Machine

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Flat grinding device

Flat finishing, flattening, and removal of protrusions for various flat surfaces.

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our flat polishing equipment is primarily used in the final finishing processes of automotive parts and electrical and electronic components, contributing to improved roughness and flatness. It also has the capability for controlled depth polishing through numerical control. 【Applications】 ◆ Flattening of laminated substrates (such as 5G substrates) ◆ Cleaning of smartphone glass ◆ Flattening of mobile communication system substrates ◆ Flattening during power semiconductor manufacturing  etc. <Reasons to Choose Sanshin's Polishing Machines> ■ Manufacturer specialized in film polishing equipment ■ Customization according to customer requests (special jigs) is possible ■ Sample testing before installation is possible with various demo machines ■ We can propose suitable polishing conditions based on processing know-how.

  • Engine parts
  • Wafer
  • lens

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