Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.
511～525 item / All 812 items
We can polish ball lenses with micron-level precision.
The high-precision ball lens polishing device Ext-1B-0606-6P/L can polish micro ball lenses and preform ball lenses related to communication and video with micron-level precision. It is possible to control the load from the upper table in a low-load manner using a pulley system. For more details, please contact us or download the catalog.
Re-polishing of treasure brooches is now possible in-house!
We have made it possible to miniaturize and reduce costs by limiting the grinding surface to the 'Heaven Blade No. 2 escape surface' (with an escape angle of 3 degrees) necessary for re-polishing the jewel brooch, and by making all axis movements manual.
There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!
Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.
It has excellent sharpness with long life and is also suitable for heavy grinding.
The "CROWN" disc has a long life and exceptional cutting performance, and it is also suitable for heavy grinding. The "Crown flap wheel" adapts well to any processing surface and maintains a consistent roughness of the grinding surface without clogging due to moderate wear, allowing for extended continuous operation.
Due to being in the research and development stage, there is not enough quantity to consider processing equipment!! In such cases, please feel free to contact us!
With the diverse processing know-how accumulated by our company, we respond to all technical needs ranging from lap and polish processing, double-sided processing, edge processing, deposition, cutting, etc. We can accommodate processing quantities starting from just one unit, so please feel free to contact us.
A standard tabletop polishing device that meets a wide range of requirements from research and development to production.
The TR15M tabletop grinding machine is a standard tabletop grinding device that meets a wide range of requirements from research and development to production. With a variety of options available, it can be customized to accommodate a wide range of applications, from lapping processes for glass, metal, and ceramics to polishing and CMP processes. For more details, please download the catalog or contact us.
We will propose the most suitable abrasive material according to your company's usage purposes.
Grinding micro powder A (fused alumina) is a representative artificial abrasive material made by melting alumina ore in an electric furnace. Grinding micro powder WA (white fused alumina) is also a representative artificial abrasive material made by melting in an electric furnace, similar to material A. Grinding micro powder KOA has fused alumina as its main component, and appears as a brown powder that is very tough. Grinding micro powder GC (green silicon carbide) is a representative artificial abrasive material made by firing quartz and coke in an electric furnace. Grinding micro powder CeO2 (cerium oxide) is a typical abrasive used for glass polishing, with various processing targets including flat glass, glass ornaments, quartz, lenses, and photomasks. ● For more details, please download the catalog or contact us.
Equipped with a function to adjust the swing angle! It can maintain an even spray balance!
The "Chemical Polishing Device" is a product that roughens the surface of copper foil to improve the adhesion of laminates. The spray nozzle pipe can be switched between vertical and horizontal arrangements, allowing it to accommodate various product conditions. The oscillation of the chemical polishing section is equipped with a function to adjust the angle of the swing, in addition to speed adjustment through electric control, enabling the spray balance to be maintained evenly. 【Features】 ■ Renders the surface of copper foil rougher to enhance laminate adhesion ■ Accommodates various product conditions ■ The spray nozzle pipe can be switched between vertical and horizontal arrangements *For more details, please refer to the PDF document or feel free to contact us.
Stable achievement of finishing surface precision below Rz0.8μ (Ra0.2μ) ■Industry: Automotive (prototype) / Semiconductor / Robotics
The film is retractable, allowing for continuous exposure of a new surface during polishing, achieving a finishing surface accuracy of Rz0.8μ (Ra0.2μ) or less consistently. Additionally, it can flexibly accommodate a variety of products through programming. 【Main Usage Examples】 Polishing of automotive parts (such as AT transmissions and shock absorbers) Polishing of crankshaft, camshaft, and seat surfaces of hydraulic and pneumatic valves Finishing polishing of painting rollers for printers and similar equipment Precision polishing of rollers for paper and film manufacturing and printing *For more details, please refer to the PDF materials or feel free to contact us.
![Flap Wheel "KF Wheel" [Excellent Flexibility & Uniform Finish]](https://image.mono.ipros.com/public/product/image/019/2000262617/IPROS86018292581800512730.jpeg?w=280&h=280)
Achieves good flexibility and a uniform finish! General flap wheel.
■For catalog downloads and inquiries, please visit the following URL and click on [Request Materials Here]. http://www.koyo-sha.co.jp/ KF wheels have a long product life and a consistent surface roughness, making them easy to automate. The air cooling effect helps to prevent burning of the workpiece while providing good "familiarity" with the shape, allowing for curved surface polishing. <Features> ■Moderate wear prevents clogging. ■Can be used as a substitute for emery buffs. ■Long product life and consistent surface roughness make automation easy. ■The air cooling effect helps to prevent burning of the workpiece. ■Good "familiarity" with the shape of the workpiece allows for easy curved surface polishing. ■Designed for dry use, offering great flexibility and achieving a more uniform finish. <Type-Specific Performance> ・DAK... A general type with a uniform finish that is easy to connect to the next process (for dry use). ・YWK... Performance that is intermediate between standard wheels and resin-bonded polishing cloth wheels (for dry use).
A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!
"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.
We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.
IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A unified production system from design to assembly in-house - Speedy response: Detailed and prompt support *For more details, please download the materials or contact us directly.
![Sample Automatic Polishing Machine [Customizable Design Possible Due to In-House Design] [Made in Japan]](https://image.mono.ipros.com/public/product/image/9f2/2000234130/IPROS39491546112510002488.jpeg?w=280&h=280)
Ideal for high-precision sample preparation! We also propose optimal polishing conditions! Reliable domestic machines with comprehensive after-sales support!
"KIRIME" is an automatic sample polishing machine that allows for overall load/individual load and offers two polishing styles. You can select up to six conditions from memory to create an auto-change recipe. It is ideal for producing high-precision samples necessary for quality improvement and the development of new materials. 【Features】 ■ Two selectable polishing styles ・ Overall load method → A high polishing force overall load method. ・ Individual load method → Capable of mounting up to six samples. ■ Equipped with a polishing disk cooling function ■ Capable of communication and connection with an automatic abrasive drip device ■ Demonstration machines are available at various locations in Tokyo, Nagoya, and Osaka for demonstrations All products are domestically produced, and maintenance and after-sales support are available on the same day. Additionally, based on our achievements in the semiconductor, LCD, electronics, and machinery industries, we can customize (special fixtures) and propose solutions according to customer requests. We also offer suggestions for optimal polishing conditions. *For product details, please request materials or view the PDF data available for download. A free technical document with sample polishing recipe selection guidelines is also available for download below.
![Sample Grinding Machine 2-Stage Grinder "Eo2" [Made in Japan]](https://image.mono.ipros.com/public/product/image/901/2000250224/IPROS25681173147677437950.jpeg?w=280&h=280)
High torque! Low price! Cute logo! A dual machine with triple grinding capabilities!
The "Eo2" is a two-disk device specifically designed for hand polishing. It features a table height that makes hand polishing easy, allowing for comfortable work. It is equipped with a motor that delivers strong torque even at high speeds and low ranges. It comes with two water supply taps and a drainage hose at the back. 【Disc Sizes】 ○ Polishing Disc: Φ223mm or Φ200mm ○ AL Polishing Disc: Φ200mm ○ Magnetic Surface Disc: Φ200mm For more details, please contact us or download the catalog.
![Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan]](https://image.mono.ipros.com/public/product/image/b48/2000250226/IPROS42251945461782166939.jpeg?w=280&h=280)
Adopts an individual loading method! It is a sample polishing machine that allows grinding without losing parallelism.
The "Rana-3" adopts an individual load method and is a sample polishing machine that allows for the free setting of 1 to 6 samples. Since it is possible to change the holder rotation speed, the holder and disk can be polished at the same rotation speed, preventing the polishing surface from tilting or becoming pencil-shaped. Both the holder and disk can rotate in both forward and reverse directions. 【Features】 ○ Grinding can be performed without losing parallelism ○ Automatic increase and decrease of pressing force up to the set seconds ○ Three-stage variable polishing conditions (pressure/rotation speed) ○ Memory for 16 polishing conditions For more details, please contact us or download the catalog.
