Molding, cutting, grinding, polishing
Leave it to us from material procurement! We handle everything from molding, cutting, grinding, to polishing in a seamless process!
Our company has been engaged in the processing of various materials such as ceramics, resins, glass, magnetic materials, sintered products, and difficult-to-machine materials through "molding, cutting, grinding, and polishing." If requested, we can provide integrated processing from material procurement to the desired product. Of course, it is also possible to supply the processing target material and only undertake the processing. In particular, our processing using the multi-wire saw we own allows for a cutting method that minimizes kerf loss, thereby reducing material waste. Additionally, the high cutting precision is a significant advantage. This method can be said to be skilled at efficiently turning materials into products. Our company also handles not only cutting but also grinding, polishing, and precision processing. If you have any concerns about processing methods, please feel free to consult us. 【Features】 ■ Molding: Thin-walled sleeves (even in SUS), with the thinnest sleeve possible at 4.5mm ■ Cutting: High yield, low kerf loss, and cost-effective ■ Grinding: High-precision flat grinding is possible ■ Polishing: High-precision lapping and polishing (mirror finish) are possible *For more details, please refer to the PDF document or feel free to contact us. You can also check the available sizes in the PDF.
- Company：大阪富士工業
- Price：Other
