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Polishing×エムワン精工 - List of Manufacturers, Suppliers, Companies and Products

Polishing Product List

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Internal diameter grinding

We are constantly devising ways to secure products safely without applying unnecessary force.

At M1 Seiko, we have accumulated extensive know-how over the years, and we select the most suitable processing methods while considering the stresses on our products to provide high-precision "inner diameter grinding." We offer a wide range of chucking fixtures that can be used in various applications, and we are constantly developing methods to securely fix products without applying unnecessary force. Additionally, our CNC inner diameter grinding machines are currently equipped with high-frequency spindles that boast a high level of precision. 【Equipment】 - We always have five spindles available for general inner diameter grinding machines. - Each spindle is regularly assessed based on usage time, unusual noises during rotation, and variations in precision, and we perform timely overhauls to maintain accuracy. - Our CNC inner diameter grinding machines utilize high-frequency spindles that achieve a high level of precision. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment

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Cylindrical grinding

If you have any requests, we can also provide advice regarding your products.

At M1 Seiko, we have extensive experience and know-how in "cylindrical grinding," providing processing at the micron level. In response to customer demands for higher precision products, we also perform work to increase the hardness of the center hole through heat treatment, followed by lapping with a conical lap bar after grinding. By following such processes, the center hole, which serves as the standard for the product, can maintain high precision, allowing for finishing using a stable reference center hole even during subsequent additional processing or dimensional changes. 【Commitment to Shaft Precision】 - When processing high-precision shafts such as spindles and precision shafts, we always use dedicated grinding machines for center hole grinding. - By grinding the hardened center hole, we prevent sagging during cylindrical grinding and reduce wear resistance with dedicated molybdenum grease, improving roundness and cylindrical accuracy. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment

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Screw polishing

M1 Seiko specializes in extremely high-precision special screw grinding processing.

At M1 Seiko, we specialize in extremely high-precision "special screw grinding processing," rather than the so-called general-purpose screws for industrial use. Our products are utilized in various fields such as automobiles, machine tools, semiconductor manufacturing equipment, aircraft, and academic research, and we have received high praise, particularly for extremely high-precision prototypes and samples that are required in the pre-mass production stage. In recent years, they have also been used in precision positioning devices such as actuators. *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment

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Centerless grinding

In addition to medical devices and various gauges, we can also handle rare metals that are considered difficult to manage.

M1 Seiko provides high-level domestic "precision centerless grinding processing." Typically, in the field of centerless grinding, high precision often refers to a diameter tolerance of about 2/1,000 mm. Our company can achieve roundness of 3/10,000 mm at mass production levels. Additionally, we can handle medical devices and various gauges where precision cannot be compromised, as well as rare metals, which are often difficult to process in most factories. 【Features】 ■ Provides high-level domestic precision centerless grinding processing ■ Achieves roundness of 3/10,000 mm at mass production levels ■ Capable of handling medical devices, various gauges, and rare metals *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment

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