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Processing Machine Product List and Ranking from 938 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Processing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. アマダ（アマダグループ） Kanagawa//Industrial Machinery
  2. 三晃工具 Gifu//Industrial Machinery
  3. 大野精工 機工販売事業部 Aichi//Industrial Machinery
  4. 4 null/null
  5. 5 舘野機械製作所 八王子工場/営業部 Tokyo//Industrial Machinery
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Processing Machine Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Aluminum NC Long-Length Processing Machine "INXII" 三晃工具
  2. Small Flat Glass Perimeter Processing Machine 'BAV-S5 Model' 舘野機械製作所 八王子工場/営業部
  3. Plastic mold steel "KTSM3M" 日本金型材
  4. 4 Electric Fugu Skin Slicing Machine "Fugu Skin Slicing Master" サンテクノ久我
  5. 5 New release of the CNC wire EDM precision contouring machine 'TX-150'! TAINATEC

Processing Machine Product List

1921～1935 item / All 2598 items

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Introduction to examples of inner layer copper foil machining.

Introduction to examples of inner layer copper foil machining.

【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

  • Circuit board processing machine

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CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

  • Circuit board processing machine

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CO2 Laser Processing [ABF Resin Direct Processing Results]

CO2 Laser Processing [ABF Resin Direct Processing Results]

■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

  • Circuit board processing machine

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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

  • Processing Contract

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Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Suppresses substrate warping, enabling high-precision notching! Automatic correction for each axis independently during processing.

The "ECO-RM Series" is a contour processing machine with individually driven axes that can perform high-precision contour machining for patterns. With axis alignment correction, it automatically compensates for the expansion and rotation of the substrate on a per-axis basis (when equipped with a CCD camera). The machine itself drills reference holes and sets inner pins for substrate fixation, enabling high-precision alignment processing for each piece when used in conjunction with the axis alignment correction function. 【Features】 ■ Axis Alignment Correction - Automatically compensates for substrate expansion and rotation on a per-axis basis - Enables high-precision contour machining for patterns ■ Automatic Pin Insertion Function (Optional) - The machine drills reference holes and sets inner pins for substrate fixation - Allows for high-precision alignment processing for each piece *For more details, please refer to the PDF document or feel free to contact us.

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  • Other processing machines

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Laser processing machine - multipurpose single-axis laser processing machine

Laser processing machine - multipurpose single-axis laser processing machine

Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

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  • Other processing machines

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CO2 Laser Processing Example: Package Substrate Processing

CO2 Laser Processing Example: Package Substrate Processing

Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct TH Processing

CO2 Laser Processing Example_Cu Direct TH Processing

Cu Direct Double-Sided Through Hole Processing

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct BH Processing

CO2 Laser Processing Example_Cu Direct BH Processing

Cu Direct Blind Processing Examples

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

  • Processing Contract

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UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

Case study of UV and CO2 laser hybrid processing of Cu+PP materials

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

  • Processing Contract

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UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

Examples of UV laser processing applications for various materials.

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

  • Processing Contract

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UV Laser Processing Example: Package Substrate

UV Laser Processing Example: Package Substrate

Examples of micro-diameter hole processing for package substrates

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

  • Processing Contract

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UV Laser Various Processing Examples

UV Laser Various Processing Examples

We offer a wide range of services from the sale of UV laser processing machines to initial development and contract processing for small-scale production!

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.

  • Processing Contract

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CO2 Laser Processing Examples

CO2 Laser Processing Examples

We offer a wide range of services from the sale of CO2 laser processing machines to initial development, contract processing for small-scale production, and manufacturing sales.

We sell our own developed laser processing machines, but we also accept contract processing from development products to mass-produced items. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

  • Processing Contract

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Shape processing machine alignment function

Shape processing machine alignment function

High-precision contour processing is possible with recognition of the substrate shape and added alignment correction!

High-precision processing with alignment correction is possible by recognizing the shape of the substrate. 【Features】 - Position measurement is performed for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision counterboring is possible.

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