Can be used for various applications! Such as patterning of organic devices and cutting of metal wiring for ICs, etc.
We provide a YAG laser thin film processing system that is widely used for semiconductor development, failure analysis, and repair applications such as FPD.
It offers stable, high-quality laser irradiation at both high and low power, significantly reducing the impact on the substrate and surrounding areas, and enabling high-quality laser processing on materials different from conventional ones.
**Main Applications:**
- Removal of protective films and organic thin films using DUV lasers
- Cutting and removal of IC metal wiring such as gold and aluminum, exposing underlying patterns
- Drilling for EB testers and probing
- Pre-treatment for FIB (such as pre-processing), pre-treatment for SEM, TEM, etc. (such as marking)
- Precise transfer of laser marks from the back surface of samples to the front using failure analysis equipment
- Simple photomask creation and photomask modification
- Correction of various defects in FPDs: CF protrusion correction, OC foreign matter protrusion correction, ITO short cutting, etc.
- Direct patterning on organic films and correction of pattern collapse
- Spot annealing
- Integration into electrical measurement systems for defect and failure analysis, etc.
We can customize and provide integration into various devices such as semi-auto systems and probers for a wide range of applications.