Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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This is the static elimination grade of Bespel (R) products.
If there is stock of the materials for processing, same-day shipping is possible. Standard sizes are listed on our website. Please take a look. We can accommodate processed parts from one piece. Feel free to contact us.
![[Research Material] The Global Market for Chromatography Silica Resins](https://image.mono.ipros.com/public/product/image/712/2000835416/IPROS43762320366836472193.jpeg?w=280&h=280)
World Market for Chromatography Silica Resins: 30-60, 60-100, 100-200, over 200, Pharmaceuticals & Biotechnology, ...
This research report (Global Chromatographic Silica Resins Market) investigates and analyzes the current state and outlook for the global market of chromatographic silica resins over the next five years. It includes information on the overview of the global chromatographic silica resins market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the chromatographic silica resins market focus on ranges of 30-60, 60-100, 100-200, and over 200, while the segments by application target pharmaceuticals & biotechnology and food & chemicals. The regional segments calculate the market size of chromatographic silica resins by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in chromatographic silica resins, product and business overviews, and sales performance.
Achieving a balance between high intensity and high productivity. Contributing to weight reduction and cost reduction with excellent hardening properties and CFRP material characteristics. Exhibited at the Advanced Materials Technology Exhibition 2022.
The "CBZ Series" is a thermosetting resin that excels in adhesion to various fibers, including carbon fiber, and enables the production of FRP with excellent mechanical properties. Like general unsaturated polyester resins and vinyl ester resins, it can be applied to various molding methods. We offer "Liquid CBZ," which can cure at room temperature to high temperatures, and "Prepreg CBZ," which is styrene-free and has low shrinkage. 【Features】 ■ High adhesion to carbon fibers sized for epoxy resins ■ High adhesion to glass, aramid, and basalt fibers ■ Excellent mechanical properties in bending, compression, and interlaminar shear strength ■ Low water absorption and low moisture absorption ■ Oil resistance and gasoline resistance *For more details, please refer to the PDF materials or feel free to contact us. ★ We will be exhibiting at the "Advanced Materials Technology Exhibition 2022," which will be held from October 19 (Wednesday). We will conduct panel displays introducing our initiatives related to composite materials such as carbon fiber composites, as well as product and technology presentations.
We offer a wide range of liquid epoxy resin encapsulants with a maximum Tg (glass transition temperature) of 308°C under our own brand, TERADITE.
Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.
Oil-based, two-component curing (high acid value)! Introducing high acid value acrylic polymer for adhesives.
"1HY" is a high acid value acrylic polymer for adhesives. *For more details, please refer to the related link page or feel free to contact us.*
For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.
Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.
For the electrical and electronic components, and food packaging industries! It has peelability and abrasion resistance, and allows for weight reduction!
We would like to introduce 'TPX (Poly(methyl pentene))' handled by Asahi Molding. It has release properties and abrasion resistance, and it is lightweight. The heat resistance melting point is between 220 and 240°C. It can be used for applications such as release films, electrical and electronic components, and food packaging materials. 【Features】 ■ Release properties and abrasion resistance ■ Lightweight ■ UV transmittance ■ Heat resistance: melting point is 220-240°C ■ Block performance: block shipments available *For more details, please refer to the PDF document or feel free to contact us.
Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.
Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.
Standard laminated board used as electrical and electronic machine components.
Bakelite laminate has been widely used as an insulating material and structural material for electronic components and electromechanical applications since its launch, thanks to its excellent machinability and physical properties. 【FL-FLE (Basic Grade)】 Color: Brown (natural color), Black Applicable Standards: - JIS Standards: PL-FLE (fine thread cloth), PL-FCM (coarse thread cloth) - ANSI Standards: (LE) Features: Intermediate electrical properties, good mechanical strength, good machinability Applications: Electromechanical parts requiring impact resistance Standard Product Dimensions: - Thickness (mm): 3.0 to 100.0 - Standard Sizes: 1,020×1,020, 1,020×2,043 UL Standard: 94HB Our company precisely processes Bakelite using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.
Established vacuum clamping fixation method! Achieved parallelism of 0.02 with dimensions of 0.4mm × 150 × 400mm.
The processing of thermosetting resins is our "origin." We excel in high-hardness materials and high-precision machining, starting with insulators and large products. Please feel free to contact us with your requests. 【Features】 ■ Cutting technology for high-hardness thermosetting resin materials - High-precision processing of high-hardness epoxy resin materials - Establishing processing conditions from equipment and cutting tools ■ Thin plate cutting technology for thermosetting materials - Established a precision of 0.02 in parallelism with 0.4mm thin glass epoxy material processing - Established a vacuum clamping fixation method *For more details, please refer to the related links or feel free to contact us.
Instant curing with UV irradiation. Protects the target areas from blasting, acids, alkalis, and paints. There are various methods for removal.
This is a liquid-type masking resin that cures under UV irradiation. It is resistant to various substances such as sandblasting, high-temperature acids and alkalis, plating, and painting, protecting the target areas. Application methods: Syringe, brush, dip, spray, etc. Removal methods: Peel-off type, water-soluble type, type that can be peeled off when heated to 50-80°C, incinerable type.
For medical devices and analytical instruments! It has chemical resistance and the surface tension is smaller than that of fluororesin!
We would like to introduce 'PMP (Poly(methyl pentene) resin)' handled by Asahi Molding. The melting point for heat resistance is 230-240°C, and the Vicat softening point is 160-170°C. It has excellent chemical resistance, and its surface tension is second only to fluororesins. Additionally, it has the lowest dielectric constant among synthetic resins. 【Features】 ■ Density: 0.83 ■ Chemical resistance ■ Surface tension is second only to fluororesins ■ Dielectric constant is the lowest among synthetic resins ■ Block performance: Block shipments available *For more details, please refer to the PDF document or feel free to contact us.
We use materials with an ozone depletion potential of zero and an extremely low global warming potential!
Rigid polyurethane insulation materials with higher thermal insulation performance and technology have become widely used. To promote environmental harmony, our company was one of the first in the country to introduce cyclopentane foaming equipment in 1994 (using materials with an ozone depletion potential of zero and an extremely low global warming potential). Our company turns ideas into "forms" through technology. Please feel free to contact us when you need assistance. 【Specifications】 ■Materials - Polyurethane - Thermosetting resin - Assembled products *For more details, please refer to the PDF document or feel free to contact us.
