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Resin(tg) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
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Resin Product List

61～85 item / All 85 items

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UV-curable resin, high thixotropic type TRU-0250K

UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

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Low viscosity UV-curable resin TRU-0201K

Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

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UV-curable resin, high strength type TRU-0212

UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

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Polyimide Therplim Low Friction Grade

Polyimide Therplim Low Friction Grade

Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.

Introducing our crystalline thermoplastic polyimide "Therplim Low Friction Grade." It is suitable for applications requiring a high Tg (185°C) and serves as an alternative to super engineering plastics like PEEK. * For more details, please refer to the PDF document or feel free to contact us.

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TE-7901K for semiconductors

TE-7901K for semiconductors

One-liquid type × high thermal conductivity! For thermal management of high-density mounted substrates.

In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency

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[For Communication Speedup] TE-7901K

[For Communication Speedup] TE-7901K

One-liquid type × high thermal conductivity! For thermal management in communication devices. Supports high-speed operation.

In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure

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[For Robots] TE-7901K

[For Robots] TE-7901K

One-liquid type × high thermal conductivity! Heat-dissipating insulating epoxy resin that supports the precise movements of robots.

In the robotics industry, the reliability of electronic components is crucial for high-precision operation and longevity. In particular, temperature management of components that generate heat, such as motors and sensors, is a key factor that influences the performance of robots. Deterioration of components due to heat can lead to malfunctions and failures, potentially reducing the overall operational rate of the robot. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, protecting the electronic components inside the robot from heat. [Usage Scenarios] - Motors of precision robots - Heat dissipation measures for sensors - Insulation sealing for high-density mounted circuit boards [Effects of Implementation] - Extended lifespan of components - Stable operation of robots - Reduction in maintenance costs

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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Single-component heat-curing epoxy resin for home appliances TE-7901K

Single-component heat-curing epoxy resin for home appliances TE-7901K

One-liquid type × high thermal conductivity! Contributes to improving the durability of home appliances.

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

One-liquid type × High thermal conductivity 6.5W/mK! Contributes to the reliability improvement of electronic devices.

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

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Thermoplastic Polyimide Resin "Therplim"

Thermoplastic Polyimide Resin "Therplim"

Thermoplastic polyimide resin with unprecedented moldability and heat resistance.

Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

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[Research Material] Global Market for Agarose Resin

[Research Material] Global Market for Agarose Resin

Global Market for Agar Resin: Powder, Granules, Sheets, Pharmaceuticals, Food & Beverages, Cosmetics & Personal Care Industry, Nutritional Supplements

This research report (Global Agar Resin Market) investigates and analyzes the current state and outlook for the global agar resin market over the next five years. It includes information on the overview of the global agar resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the agar resin market include powder, granules, and sheets, while the segments by application cover pharmaceuticals, food & beverages, cosmetics and personal care industries, and dietary supplements. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of agar resin. It also includes the market share of major companies in the agar resin sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Optical Elastic Resin (SVR)

[Research Material] Global Market for Optical Elastic Resin (SVR)

Global Market for Optical Elastic Resin (SVR): Large-scale FPD, Medium and Small-scale FPD, Smartphones, PCs, Automobiles, Others

This research report (Global Optical Elasticity Resin (SVR) Market) investigates and analyzes the current state and outlook for the global market of optical elasticity resin (SVR) over the next five years. It includes information on the overview of the global optical elasticity resin (SVR) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on large-scale FPD and small to medium-scale FPD, while the segments by application target smartphones, PCs, automobiles, and others. The regional segments calculate the market size of optical elasticity resin (SVR) by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the optical elasticity resin (SVR) market, product and business overviews, and sales performance.

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[Research Material] Global Market for Epoxy Resin E-44

[Research Material] Global Market for Epoxy Resin E-44

World Market for Epoxy Resin E-44: Single Component, Two Component, Multi Component, Paints & Coatings, ...

This research report (Global Epoxy Resin E-44 Market) investigates and analyzes the current status and outlook for the global market of epoxy resin E-44 over the next five years. It includes information on the overview of the global epoxy resin E-44 market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include single-component, two-component, and multi-component, while the segments by application focus on paints & coatings, composites, and construction. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of epoxy resin E-44. It also includes the market share of major companies in the epoxy resin E-44 sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Liquid Epoxy Resins

[Research Material] Global Market for Liquid Epoxy Resins

Global Market for Liquid Epoxy Resins: Low Viscosity Liquid Epoxy Resins, High Viscosity Liquid Epoxy Resins, Chemical Industry, Water Conservation, Automotive, Electronics, Others

This research report (Global Liquid Epoxy Resins Market) investigates and analyzes the current state and outlook for the global liquid epoxy resins market over the next five years. It includes information on the overview of the global liquid epoxy resins market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the liquid epoxy resins market focus on low-viscosity liquid epoxy resins and high-viscosity liquid epoxy resins, while the segments by application target the chemical industry, water conservation, automotive, electronics, and others. The regional segments calculate the market size of liquid epoxy resins by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in liquid epoxy resins, product and business overviews, and sales performance.

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[Research Material] Global Market for PC & ASA Resins

[Research Material] Global Market for PC & ASA Resins

World Market for PC & ASA Resins: General Use, High Heat Use, Others, Automotive, Electrical & Electronics, IT & Communication, Others

This research report (Global PC & ASA Resin Market) investigates and analyzes the current state and future outlook of the global market for PC and ASA resins over the next five years. It includes information on the overview of the global PC and ASA resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the PC and ASA resin market by type include general-purpose, high-heat, and others, while the segments by application cover automotive, electrical and electronics, IT and communications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of PC and ASA resins. It also includes the market share of major companies in the PC and ASA resin market, product and business overviews, and sales performance.

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[Research Material] Global Market for Pharmaceutical-Grade Polyacrylic Resins

[Research Material] Global Market for Pharmaceutical-Grade Polyacrylic Resins

World Market for Pharmaceutical Polyacrylic Resins: Polyacrylic Resin III, Polyacrylic Resin II, Polyacrylic Resin IV, Others, Tablets, P ...

This research report (Global Pharmaceutical Polyacrylic Resin Market) investigates and analyzes the current status and outlook for the global market of pharmaceutical polyacrylic resins over the next five years. It includes information on the overview of the global pharmaceutical polyacrylic resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the pharmaceutical polyacrylic resin market include Polyacrylic Resin III, Polyacrylic Resin II, Polyacrylic Resin IV, and others, while the segments by application include tablets, pills, granules, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of pharmaceutical polyacrylic resins. It also includes the market share of major companies in the pharmaceutical polyacrylic resin sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Polyvinyl Alcohol (PVA) Resin

[Research Material] Global Market for Polyvinyl Alcohol (PVA) Resin

Global Market for Polyvinyl Alcohol (PVA) Resin: Industrial, Medical, Textiles, Paper Industry, Construction & Decoration, Pharmaceuticals, Others

This research report (Global Polyvinyl Alcohol (PVA) Resin Market) investigates and analyzes the current status and outlook for the global market of polyvinyl alcohol (PVA) resin over the next five years. It includes information on the overview of the global polyvinyl alcohol (PVA) resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments for polyvinyl alcohol (PVA) resin by type are targeted at industrial and medical uses, while the segments by application focus on textiles, paper industry, construction and decoration, pharmaceuticals, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of polyvinyl alcohol (PVA) resin. It also includes the market share of major companies in the polyvinyl alcohol (PVA) resin sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Polybutylene Resin

[Research Material] Global Market for Polybutylene Resin

World Market for Polybutylene Resin: Polybutene-1 Homopolymer (PB-H), Polybutene-1 Random Copolymer (PB-R), Piping Sh...

This research report (Global Polybutylene Resin Market) investigates and analyzes the current state and future outlook of the global polybutylene resin market over the next five years. It includes information on the overview of the global polybutylene resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the polybutylene resin market focus on polybutene-1 homopolymer (PB-H) and polybutene-1 random copolymer (PB-R), while the segments by application cover piping systems, plastic packaging, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of polybutylene resin. It also includes the market share of major companies in the polybutylene resin sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Hydrogenated C9 Hydrocarbon Resins

[Research Material] Global Market for Hydrogenated C9 Hydrocarbon Resins

Global Market for Hydrogenated C9 Hydrocarbon Resins: Hydrogenated C9 Petroleum Resins, Hydrogenated C5/C9, Coatings, Adhesives & Sealants, Printing Inks, Packaging Materials, Others

This research report (Global Hydrogenated C9 Hydrocarbon Resin Market) investigates and analyzes the current status and outlook for the global market of hydrogenated C9 hydrocarbon resins over the next five years. It includes information on the overview of the global hydrogenated C9 hydrocarbon resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include hydrogenated C9 petroleum resins and hydrogenated C5/C9, while the segments by application cover paints, adhesives and sealants, printing inks, packaging materials, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of hydrogenated C9 hydrocarbon resins. It also includes the market share of major companies in hydrogenated C9 hydrocarbon resins, product and business overviews, and sales performance.

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[Research Material] Global Market for Ceramic Filled Photopolymer Resins

[Research Material] Global Market for Ceramic Filled Photopolymer Resins

World Market for Ceramic Filled Photopolymer Resins: Bisphenol A Type Epoxy Acrylate, Polyurethane Acrylate, Aerospace, Building Materials ...

This research report (Global Ceramic-Filled Photosensitive Resin Market) investigates and analyzes the current status and outlook for the global market of ceramic-filled photosensitive resins over the next five years. It includes information on the overview of the global ceramic-filled photosensitive resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the ceramic-filled photosensitive resin market focus on bisphenol A type epoxy acrylate and polyurethane acrylate, while the segments by application target aerospace, construction materials, consumer goods, medical, and dental applications. The regional segments are classified into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of ceramic-filled photosensitive resins. It also includes the market share of major companies in the ceramic-filled photosensitive resin market, product and business overviews, and sales performance.

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[Research Material] The Global Market for Mixed-Mode Chromatography Resins

[Research Material] The Global Market for Mixed-Mode Chromatography Resins

World Market for Mixed-Mode Chromatography Resins: Ion Exchange and Hydrophobic Types, Hydroxyapatite Type, Monoclonal Antibodies ...

This research report (Global Mixed-mode Chromatography Resin Market) investigates and analyzes the current state and outlook for the next five years of the global mixed-mode chromatography resin market. It includes information on the overview of the global mixed-mode chromatography resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the mixed-mode chromatography resin market focus on ion exchange/hydrophobic types and hydroxyapatite types, while the segments by application cover monoclonal antibodies, non-antibody proteins, polyclonal antibodies, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of mixed-mode chromatography resins. It also includes the market share of major companies in the mixed-mode chromatography resin market, product and business overviews, and sales performance.

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