Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)
Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.
Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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[Usage] ■ 5G-related components (LCP, MPI alternatives) ■ Alloy applications (PEEK, PEI, LCP) ■ CFRP raw materials ■ Audio equipment parts ■ FPC boards (copper-clad boards), etc. * For more details, please refer to the PDF document or feel free to contact us. Shanghai Lingxiao Trading Co., Ltd. http://shryoyo.com/index.html
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[Green Energy & Chemical Division] With the motto "Expanding in quantity overseas and expanding horizontally domestically," we aim to expand and strengthen our business foundation. For methanol, which is our main product, we will actively pursue overseas expansion while also developing life science product groups, enhancing MMA downstream, and expanding our catalyst business domestically.
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