Waterproof and dustproof sealing in 30 seconds! Enhancing the long-term reliability of security devices.
Waterproof, dustproof, low-pressure molding, substrate encapsulation, hot melt, LPM, security, communication, IoT, sensors, cameras, crime prevention, condensation, miniaturization, vibration resistance.
"Protect security equipment from rain, condensation, and dust" - High-reliability hot melt molding that achieves waterproof, dustproof, and vibration-resistant properties!!
In security devices that require stable operation 24 hours a day, 365 days a year, ensuring long-term reliability is crucial to prevent failures caused by environmental factors such as rain, condensation, and dust. Hot melt molding achieves high waterproofing, dustproofing, and vibration resistance by directly sealing electronic units. It protects electronic components from external environments while also contributing to miniaturization and weight reduction. Furthermore, by reducing potting processes and waterproof cases, it helps to minimize the number of parts and labor, leading to reduced manufacturing costs. **POINTS of Hot Melt Molding** 1. High Reliability It has over 20 years of proven use in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. 2. Gentle Low-Pressure Molding for Electronic Components Molding is done at extremely low pressures of 0.3 to 5 MPa, preventing damage to the sealed electronic components. 3. Excellent Productivity Sealing is completed in just a few dozen seconds per shot, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Weight Reduction It enables "miniaturization and weight reduction" by allowing molding that conforms to the components without the need for housing. 5. Environmentally Friendly It uses hot melt materials primarily made from plant-based raw materials, contributing to reduced environmental impact.
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basic information
○ Do you have any of the following concerns? - I want to prevent circuit board failures caused by rainwater or condensation when installed outdoors. - I want to improve reliability in high-humidity environments. - I want to reduce the risk of failure due to drops or impacts. - I have many components such as waterproof cases and sealing parts, and I want to reduce costs. - The curing time in the potting process is long, and improving productivity is an issue. - I want to promote miniaturization and lightweighting of components. etc. Hot melt molding is an effective sealing and protection method for solving these issues. ○ Examples of achievable performance Waterproof and dustproof achievements: up to IP67,68 Operating temperature: -40 to 150℃ Flame retardancy: UL94 V-0 etc. It provides various environmental resistance features such as waterproofing, dustproofing, insulation, vibration resistance, and explosion-proofing. At Matsumoto Processing, we select hot melt materials tailored to your product specifications and usage environment, and we handle everything from modeling to prototyping and evaluation. Additionally, we offer support for in-house production, including equipment installation, mold making, optimization of molding conditions, and mass production startup, as well as contract molding services, providing consistent support from prototyping to mass production. Please feel free to consult with us.
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Applications/Examples of results
【Adoption Examples】 - Waterproof sealing of electrical components for automotive interior and exterior (control boards, sensors, harnesses, switches, camera modules, etc.) - Waterproof and dustproof sealing of electrical components for FA equipment (control boards, sensors, camera modules, etc.) - Waterproof sealing of electrical components for infrastructure equipment (control boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Waterproof sealing of industrial communication and IoT devices - Waterproof sealing of angle sensors mounted on agricultural and construction machinery - Waterproof sealing of motor stators and related electrical components - Waterproof sealing of various sensors such as current sensors, gas sensors, and temperature sensors (automotive/industrial/consumer) etc. 【For such applications】 - Control boards for outdoor cameras - Communication module boards - Power supply boards - LED lighting units - Motion sensors - Human detection sensors - Vibration detection sensors - Connection points for cables and connectors - RFID modules etc. Recently, we have received numerous inquiries aimed at ensuring waterproof and dustproof properties while also reducing the size and weight of products. For more specific adoption examples or molding samples, please feel free to contact us.
Detailed information
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Example of waterproof sealing for agricultural machinery substrates. The left side of the photo shows before sealing, and the right side shows after sealing (the black part is the hot melt molded section).
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Examples of insulation and dust-proof sealing for the implementation substrate. The left photo is before sealing, and the right photo is after sealing (the black part is the hot melt molded section).
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Example of waterproof sealing for photo sensors: Sealing of the substrate with amber-colored hot melt and assembly of two substrates.
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Examples of waterproof protection for Hall IC sensors
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Examples of waterproof protection for the live parts of micro switches.
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Company information
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.
