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Using carefully selected high-purity alumina.
Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent properties.
MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.
Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.
Solder with excellent heat resistance for plating electrodes! Achieving high reliability, high density, and multifunctional products for various applications!
We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.
Glazed processed substrate
It is a glazed substrate with an alkaline, lead-free amorphous glass applied to the surface of the alumina substrate, offering excellent surface smoothness and durability. It is used in thermal print heads and similar applications.
Aluminum nitride products developed using ceramic materials technology.
Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.
Silicon nitride products developed using ceramic materials technology.
Silicon nitride products developed using ceramic material technology are used in applications such as power semiconductor substrates due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.
Alumina substrates (ceramic substrates) with minimal dimensional variation in shape and thickness, small warping, bending, and waviness, possessing stable quality and excellent characteristics.
MARUWA Corporation can develop semiconductor ceramic substrates from raw materials, allowing us to meet a wide variety of requests from upstream to downstream processes, including plain substrates, laminations, and circuit formation. Our alumina substrates (ceramic substrates) have a low porosity due to fine particles, providing an excellent surface condition in terms of smoothness and flatness, as well as superior adhesion to thick and thin film materials. They exhibit minimal dimensional variation in shape and thickness, with low warping, bending, and waviness. Their physical and chemical properties remain stable even in high-temperature environments, and they excel in thermal shock resistance. Additionally, they have a thermal expansion coefficient close to that of silicon and possess high thermal conductivity. 【Features】 ■ Excellent mechanical strength, with high-strength substrates available for increased durability ■ Outstanding oil and chemical resistance ■ High dielectric breakdown voltage, surface resistance, and volume resistance, with a low dielectric constant ■ High reflectivity substrates suitable for LED applications are also available.
Antenna block, circuit board
Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements. They are used for car navigation systems, antennas for mobile phones, and Bluetooth. Circuit boards for GPS antennas for car navigation systems are manufactured in sizes of 25mm square and 20mm square. Circuit boards for GPS antennas for mobile phones are produced in sizes of 9 to 12mm square. Circuit boards for isolator capacitors are available in a 50mm square size with various materials.
