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Substrate(metal) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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Substrate Product List

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
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  • Printed Circuit Board

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

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VMIVME-2210

VMIVME-2210

64-Channel Latching or Momentary Relay Board with Built-in-Test

The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.

  • Embedded Board Computers

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers

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【English Market Research Report】Global Market for Glass Substrates

【English Market Research Report】Global Market for Glass Substrates

Global Glass Substrate Market - 2022-2029

Improvements in the manufacturing of semiconductors, electronic components, display devices, computers, and communication systems are expected to create growth opportunities in the glass substrate market. Examples of applications of glass substrates in semiconductors include complementary metal-oxide-semiconductors (CMOS), micro-electromechanical systems (MEMS), imaging, sensors, LEDs, logic ICs, ICs, power, batteries, and optoelectronics. The electronics industry is experiencing unprecedented expansion due to strong demand from emerging countries. Sub-sectors such as electronic components and systems, electric drive devices, and industrial control equipment are all expected to achieve significant growth during the forecast period.

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High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]

High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]

We possess wafer processing, various COB, and flip chip technologies! These can be applied to ultra-small sensor systems, electronic medical devices, and optoelectronic equipment.

AEMtec GmbH offers advanced chip direct mounting technology for optoelectronics and sensor systems. We possess various mounting technologies, including wafer processing, high-precision chip mounting, component mounting, unitization, and modularization. These technologies can be applied to various ultra-small sensor systems, wearable electronic medical devices, and optoelectronic device mounting. 【Mounting Technologies We Offer】 ■ Wafer Processing: UBM, balls, die processing ■ High-Precision Chip Mounting: Flip chip, chip on board ■ Component Mounting: Surface mounting ■ Unitization and Modularization: Providing mounted substrates in special shapes *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Automotive LED light/power supply board

Automotive LED light/power supply board

This is a circuit board for car light lamps, so materials with good heat dissipation are required. Therefore, it is designed as a double-sided board with an aluminum base.

Stratum 2L (with single layer metal board) Board thickness 1.8 mm Base material FR-4 + MCPCB (aluminum base) Copper thickness 2 Oz Surface treatment OSP

  • Other electronic parts

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board

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