Continuous electroplating of ultra-fine wire with a unique technology from Tokusai, achieved through thin and long processes.
At Tokusai, we can continuously electroplate ultra-fine metal wires with a minimum diameter of φ0.005mm (φ5μm) using metals such as gold, silver, copper, nickel, tin-copper, and palladium. Additionally, it is possible to apply multiple platings (such as gold, nickel, and copper) on a single wire. For example, it is possible to first apply a nickel plating as a base and then apply a gold plating on top.
【Features of Tokusai's Electroplating】
(1) No color unevenness, with uniform plating thickness (±0.2μm)
(2) Excellent adhesion
(3) Surface roughness can be reduced through post-plating drawing
【Expected Effects of Plating Processing】
(1) Improved solder wetting properties… copper plating, tin-copper plating, nickel plating, etc.
(2) Enhanced corrosion resistance… gold plating, palladium plating, etc.
(3) Control of resistance values… silver plating, copper plating, etc.
(4) Improved wear resistance… nickel plating, etc.
(5) Enhanced aesthetic appearance… gold plating, etc.
*For more details, please refer to the PDF document or feel free to contact us.
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