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bonding - メーカー・企業6社の業務用製品ランキング | イプロスものづくり

更新日： 集計期間:Jul 22, 2026～Aug 18, 2026
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bondingのメーカー・企業ランキング

更新日： 集計期間:Jul 22, 2026～Aug 18, 2026
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  1. null/null
  2. 創成電子 本社・研究所 Yamagata//Manufacturing and processing contract
  3. イデアシステム Nagano//Industrial Electrical Equipment
  4. 4 モーションファイブ Saitama//Manufacturing and processing contract
  5. 4 ピーダブルビー 草津事業所 Shiga//Industrial Electrical Equipment
企業ランキングへ

bondingの製品ランキング

更新日： 集計期間:Jul 22, 2026～Aug 18, 2026
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  1. Laser-assisted die bonding
  2. Ultrasonic die bonding
  3. Aluminum Wire Bonding [Contract Design and Manufacturing Case Study] 創成電子 本社・研究所
  4. [Blog] Ultrasonic Flip Chip Bonding
  5. Technical Data: Laser Bonding

bondingの製品一覧

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Direct bonding

Direct bonding

It enables bonding that is comparable to high-quality liquid phase bonding without the need for insert metals.

"Direct bonding" is a joining technology that melts only the joint (interface) of multiple components (conductors) by applying low voltage and high current in pulses while they are in direct contact under vacuum and under appropriate pressure. It does not require filler materials or insert metals, and it can join dissimilar materials such as iron, copper, and aluminum as long as they are conductors. Additionally, by joining processed components, it is possible to produce items that are the same as those that have been internally processed from bulk materials. [Features] - No need for filler materials or insert metals - Capable of joining dissimilar materials - Can join magnetic and non-magnetic materials - Simultaneous joining of multiple cross-sections is possible - Internal processing of bulk materials can be performed *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • bonding

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Optical bonding

Optical bonding

High yield rate and cost optimization! Optical bonding with metal shell is also available.

We would like to introduce the "Optical Bonding" manufactured by FANNAL Electronics, which we handle. The bonding series can accommodate "OCA" up to 15.6", and "LOCA/OCR" and "Silicon" up to 32". It has a high yield rate and can also support optical bonding with a metal shell. 【Features】 ■ Supports optical bonding with a metal shell ■ Newton ring elimination ■ High yield rate ■ Cost optimization *For more details, please refer to the PDF materials or feel free to contact us.

  • Touch Panel
  • LCD display
  • bonding

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Direct bonding

Direct bonding

Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.

We would like to introduce our bonding technology, "Direct Bonding." Our in-house developed bonding equipment allows for quick responses and reduces initial costs. It enhances visibility, operability, and design of display devices. Depending on the various materials you use, we propose bonding methods, adhesives, and high-performance films, which can be realized through contract processing. Bonding of curved surfaces and large products is also possible using our equipment. 【Features】 ■ Composite display devices with various materials according to their structure and material ■ Adhesives and high-performance films can be proposed according to your requirements ■ Quick responses and reduced initial costs through in-house developed bonding equipment *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment
  • Processing Contract
  • bonding

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Aluminum Wire Bonding [Contract Design and Manufacturing Case Study]

Aluminum Wire Bonding [Contract Design and Manufacturing Case Study]

Designed based on the philosophy that 'the quality, performance, and cost of a product can be designed.' One-stop contract manufacturing service from product planning, prototyping to mass production.

Our company assists customers from the product planning and design stage with an eye toward mass production. [Examples] ■ Compatible with Φ30 micrometer wire and others *For more details, please download the materials or feel free to contact us.

  • Circuit board design and manufacturing
  • bonding

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Wire bonding

Wire bonding

A technology for connecting electrodes of printed circuit boards and semiconductor packages using wires.

We will propose work methods tailored to the shape and use of the parts. We can also accommodate work starting from just one piece.

  • Printed Circuit Board
  • Other semiconductors
  • Prototype Services
  • bonding

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Implementation of light-emitting and light-receiving elements such as photodiodes and VCSELs (can be supported from one unit).

Implementation of light-emitting and light-receiving elements such as photodiodes and VCSELs (can be supported from one unit).

We offer one-stop service for wire bonding of light-emitting devices from prototype to small-scale production! *Currently providing "High-Density Mounting Specifications" and "Case Studies for Problem Solving."

We propose unique design and implementation know-how using technologies accumulated through various achievements, covering package structures, bonding methods, and material selection. We support flip chip bonding, including C4 bonding, thermal compression using NCP resin, ultrasonic GGI bonding, and AuAu thermal compression. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in bonding methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines
  • bonding

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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