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heat sink(IGBT) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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heat sink Product List

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Large freshly cut heat sink

Large freshly cut heat sink

Capable of handling high calorific values! Can be manufactured with a minimum pitch of 0.3mm and a maximum width of 3,000mm.

Zaward Co., Ltd. manufactures heat sinks using a method that "shaves" aluminum (A1060, A6063) and copper (C1100) with blades. We are capable of processing large products with narrow pitches and manufacturing up to a maximum width of 3,000mm. Our company also responds quickly to design development concerns, including design proposals based on thermal design. Please feel free to contact us when needed. 【Features】 ■ Capable of processing large products with narrow pitches 　→ Minimum pitch of 0.3mm is possible ■ Wide manufacturing capability 　→ Maximum width of 3,000mm is possible ■ Can accommodate high heat generation 　→ Compatible with high heat generating elements such as IGBTs *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system

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Introduction to Cooling Technology: Heat Sink

Introduction to Cooling Technology: Heat Sink

Various manufacturing methods tailored to applications such as size and environment! We provide optimal heat dissipation solutions.

We offer large, high-performance, and durable heat sinks as a heat dissipation solution for high-heat devices such as industrial IGBTs and communication base stations. We provide optimal heat dissipation solutions through various manufacturing methods tailored to the application, including size and environment. [Heat Sink Structures and Manufacturing Methods] ■ Aluminum Extrusion ■ Skyv Processing ■ Stacked Fins ■ Solder-Free, Press-Fit, Stacked Fins ■ IGBT Heat Sinks for Transportation Vehicles ■ Fin Shapes *For more details, please refer to the PDF materials or feel free to contact us.

  • Cooling system

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Water-Cooled Heat Sink Series

Water-Cooled Heat Sink Series

Flow path design to achieve uniform cooling

Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is primarily used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to efficient and uniform cooling within the plane, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.

  • Other semiconductor manufacturing equipment
  • Cooling system

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Water-cooled heat sink for IGBT

Water-cooled heat sink for IGBT

Lightweight due to its thickness of 3 to 15 millimeters! You can choose from various types such as double-sided, single-sided, and ultra-thin.

IGBT power devices used for various applications. We introduce the "water-cooled heat sink" that maximizes their performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models. In addition to 8 standard products, custom manufacturing is available up to approximately 500×800 millimeters. The price is for one unit, and discounts are available for orders of 2 or more, 10 or more, and 50 or more. Please contact us for more details. 【Features】 ■ Made of oxygen-free copper with excellent thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to 8 standard products, various custom products can be manufactured according to your needs ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Other electronic parts
  • Other environmental equipment

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【Excellent thermal performance!】Water cooling plates/water cooling products【The last bastion of heat dissipation】

【Excellent thermal performance!】Water cooling plates/water cooling products【The last bastion of heat dissipation】

Technical documentation regarding the last bastion of heat dissipation, "water-cooled products" <<Manufacturing range/materials/case studies, etc.>> *Thermal analysis services available!*

We would like to introduce the water-cooled products we handle. They can accommodate high heat generation, making them suitable for high-heat components such as IGBTs. Additionally, they are more compact compared to air-cooled systems, allowing for effective utilization of internal space. We have examples of products related to linear applications using AL6063 and copper pipes, as well as inverters with a heat generation of 1,500W. 【Features】 ■ Silent operation possible 　→ Usable in clean rooms ■ More compact compared to air-cooled systems 　→ Effective utilization of internal space ■ Capable of handling high heat generation 　→ Suitable for high-heat components such as IGBTs *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Low thermal expansion, high thermal conductivity, heat sink.

Low thermal expansion, high thermal conductivity, heat sink.

The optimal heat sink requires a balance between thermal expansion rate and conductivity.

Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.

  • Non-ferrous metals
  • Other semiconductors
  • diode

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices equipped with aluminum extrusion.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

  • Other electronic parts

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

  • Other electronic parts

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink for forced air cooling.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow-type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

  • Cooling system

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Heat sink for pin-mounted devices, P/FP/U series

Heat sink for pin-mounted devices, P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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Water-cooled heat sink

Water-cooled heat sink

Outstanding cooling effect!

Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.

  • Other semiconductor manufacturing equipment

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