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heat sink(lsi) - List of Manufacturers, Suppliers, Companies and Products

heat sink Product List

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Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Comb Fit Heat Sink YK/YU/YX・YC Series

Achieving high-performance heat sinks with our unique aluminum pressure welding technology!

The Comb Fit Heat Sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It realizes excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and middle fins → The width of the fins can be freely set by changing the number of middle fins (Width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb Fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air. → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together with pressure, the metals adhere to each other, improving thermal conductivity between the base and fins. → The stress generated during press-fitting and work hardening are combined to join the fins and base. → The joining strength is incomparable to simply pushing the fins into the base. *Online meetings are also possible, so please feel free to contact us.

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Thermal management for electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be freely made according to specifications for each output capacity. - Simple structure that does not require wind tunnel sheet metal. - Both sides of devices such as power modules can be mounted. 【YK Series/YU Series】 - Single-sided base type. - Fin arrangement can be freely configured according to unit composition. ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type. - Customization is possible by selecting from the standard lineup. ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, with customization options available. ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages like TO220. - Numerous standard lineup options, with dimension customization possible. ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, suitable for air cooling. - Small-scale prototypes can be produced, with dimension and processing customization available.

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High-performance heat sink (without machining)

This is a heat sink made of AlSi10Mg.

A customer approached us with the request, "Can we utilize the high degree of design freedom of metal 3D printers to improve the heat dissipation of heat sinks?" In response, we began discussions with the customer from the design stage and achieved high functionality by integrating heat dissipation fins and cooling pipes. Due to the complex structure, the difficulty of fabrication is very high, and normally, successful fabrication would require effective use of supports. However, we were able to realize this through our know-how and technical capabilities. Togane Metal Industry Co., Ltd. actively proposes the transition from existing manufacturing methods to metal 3D printing, providing various benefits to customers, including the realization of complex shapes and high functionality, as well as reduced lead times, weight reduction, and process consolidation, as seen in this case. We have numerous achievements not only with AlSi10Mg, SUS316L, and maraging steel but also with special materials such as Invar and iron-based and copper-based alloys. If you are struggling with shape constraints of existing manufacturing methods or considering a transition to metal 3D printing, please feel free to consult with us.

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