Thermal management for electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be freely made according to specifications for each output capacity. - Simple structure that does not require wind tunnel sheet metal. - Both sides of devices such as power modules can be mounted. 【YK Series/YU Series】 - Single-sided base type. - Fin arrangement can be freely configured according to unit composition. ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type. - Customization is possible by selecting from the standard lineup. ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, with customization options available. ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages like TO220. - Numerous standard lineup options, with dimension customization possible. ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, suitable for air cooling. - Small-scale prototypes can be produced, with dimension and processing customization available.

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