High-reliability mounting solutions for mixed large/small component substrates.
Support for miniaturization of MLCC! We will solve the implementation challenges in the miniaturization of specific components.
As mobile devices and other technologies advance, the miniaturization of distribution devices is progressing, while the supply of large MLCCs is becoming tight due to the rapid expansion of onboard devices for HV and EV vehicles. There is an urgent need to shift to sizes below 0603 in consumer and industrial equipment. Our company ensures reliability in mixed mounting with large components. 【Proposed Solutions】 ■ Establishing various variations of the basic characteristics of metal masks ■ Printing performance matching evaluation for various solders (Stencil Navi) ■ Aperture design to achieve electrical/mechanical performance of mounted products, considering component shapes and mask characteristics *For more details, please refer to the PDF document or feel free to contact us.
- Company:プロセス・ラボ・ミクロン
- Price:Other