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resin(cfrp) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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resin Product List

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Introduction of exhibited products at "Chemical Material Japan 2020"

Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.

Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.

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Ideal for semiconductor manufacturing! Introducing heat-resistant specifications of 'CFRP'.

Introducing "CFRP," which has heat resistance up to a maximum of 250℃ (for non-continuous use). There is also a low outgassing specification suitable for semiconductor-related applications.

In addition to the conventional room temperature specifications, we also offer a 250°C specification (non-continuous) to accommodate demanding processes. We can propose various grades according to the required heat resistance temperature. Furthermore, we have low outgassing specifications available for processes that require strict particle management, such as semiconductor manufacturing. Please feel free to contact us for more information.

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Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Thermoplastic Polyimide Resin "Therplim"

Thermoplastic polyimide resin with unprecedented moldability and heat resistance.

Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Matrix resin for "Therplim" CFRP.

Due to its high heat resistance and good moldability, it is most suitable for CFRP matrix resin.

Introducing examples of molding processing for CFRP (carbon fiber reinforced polymer) matrix resin as Therplim. Molded into UD tapes, prepregs, and films, rather than super engineering plastics like PEEK and PEKK. A new material that can replace metals with high strength and high heat resistance. Applicable to sensor components in automobiles, industrial machinery, and more. [Features] ■ Excellent moldability (secondary processing capability) ■ High heat resistance (up to 150℃), long-term heat resistance (up to 200℃) ■ High strength, flame retardant ■ Good appearance after crystallization ■ Low dielectric, high electromagnetic field shielding ⇒ Antenna, radar components * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Improved toughness, enhanced sliding properties, and low dielectric effects from various powder additives! Introduction to powder filler applications.

Introducing the powder filler application of Therplim (filler). The effects of adding powder include improved heat resistance, enhanced mechanical properties, and improved sliding properties. For example, it provides toughness and reduces weight for high heat-resistant CFRP. 【Effects of Adding Powder】 ■ Improved heat resistance ■ Increased toughness ■ Enhanced mechanical properties ■ Improved sliding properties ■ Increased chemical resistance ■ Low dielectric * For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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Toughening and fatigue resistance improvement of epoxy resin and epoxy resin-based composites.

Learn about the mechanisms for improving the toughness of composite materials using epoxy resin and enhancing the fatigue properties of epoxy resin!

Lecturer Professor Hajime Kishi, Department of Environmental Energy Engineering, Graduate School of Engineering, Hyogo Prefectural University (Formerly worked at Toray Industries, Inc. Composite Materials Research Laboratory) Target Audience: Company representatives interested in epoxy resins, composite materials, and CFRP Venue: Kawasaki City Educational and Cultural Center, Room 3【Kanagawa, Kawasaki City】 Access: 12-minute walk from JR or Keikyu Line Kawasaki Station Date and Time: November 30, 2011 (Wednesday) 13:00-16:30 Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee: 【Early Bird Discount Price】46,200 yen (tax included, including text costs) for up to 2 people from one company *Limited to Tech-Zone members who apply by November 16. Membership registration is free. *After November 16, the regular price will be 49,350 yen (tax included, including text costs) for up to 2 people from one company.

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
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