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resin(ul 94) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
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resin Product List

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【PBT】POCAN

【PBT】POCAN

POCAN — Dimensional stability and reliability for mass-production design

POCAN is a PBT (polybutylene terephthalate) engineering plastic developed by Envalior, offering excellent dimensional stability and electrical performance. Thanks to its low moisture absorption, POCAN maintains stable mechanical properties and minimal dimensional change, making it ideal for precision electrical and automotive components. POCAN provides a well-balanced combination of heat resistance, chemical resistance, and hydrolysis resistance, ensuring reliable long-term performance. Its portfolio includes unreinforced, glass-fiber-reinforced, flame-retardant, and hydrolysis-resistant grades, allowing optimized material selection for a wide range of applications. With high reproducibility in mass production and stable molding behavior, POCAN supports consistent quality and reliable manufacturing. It is a trusted PBT solution for applications where both reliability and productivity are essential.

  • Engineering Plastics
  • plastic
  • Other Auto Parts
  • resin

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【PPS】XYTRON

【PPS】XYTRON

An advanced engineering plastic ideally suited for next-generation EV electrical components and thermal management systems, combining outstanding heat resistance with exceptional chemical durability.

What is PPS? Polyphenylene Sulfide (PPS) is a high-performance engineering plastic that maintains its shape even at temperatures exceeding 200°C and offers exceptional resistance to chemicals and oils. It truly excels in environments that are challenging for conventional plastics—high heat, high mechanical load, and harsh operating conditions. Thanks to its resistance to melting, deformation, and flame, PPS is frequently used as a metal replacement material. It plays a critical role in highly reliable functional components, including: • Automotive engine-related parts • EV inverter components • Pumps and valves • Electrical and electronic devices

  • Engineering Plastics
  • resin

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【PA4T PPA】ForTii

【PA4T PPA】ForTii

ForTii — PPA performance where PA6 and PA66 reach their limits.

ForTii is a high-performance PPA (polyphthalamide) material portfolio developed by Envalior, designed for applications where conventional polyamides such as PA6 and PA66 no longer meet thermal, mechanical, or long-term reliability requirements. It is specifically engineered to perform under continuous high-temperature, high-humidity, and high-load conditions, making it a preferred choice for demanding automotive, electrical & electronics, and industrial applications. Compared with standard polyamides, ForTii offers significantly higher heat resistance, superior mechanical property retention at elevated temperatures, and excellent dimensional stability. These characteristics enable reliable performance in environments exposed to thermal aging, heat cycling, and long-term mechanical stress. As a result, ForTii is widely adopted in engine-adjacent components, high-temperature electrical connectors, and precision structural parts where failure is not an option. The ForTii portfolio includes unreinforced grades as well as glass-fiber-reinforced, flame-retardant, hydrolysis-resistant, and high-flow variants. This broad lineup allows designers to optimize material selection according to specific application requirements such as thin-wall molding, metal replacement, or part integration. In addition, ForTii supports lightweight design strategies while maintaining mechanical integrity and long-term reliability. For applications where durability and performance stability over the entire service life are critical, ForTii is not merely an alternative material—it is often the baseline solution. Its proven global track record and robust performance make it a trusted PPA material for engineers facing the most demanding design challenges.

  • Other Auto Parts
  • Engine parts
  • Automotive Connectors
  • resin

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Design and Practice of Transparent Flame Retardant Resins, Combustibility Testing and Evaluation Criteria, Trends in UL Standards

Design and Practice of Transparent Flame Retardant Resins, Combustibility Testing and Evaluation Criteria, Trends in UL Standards

Flame retardant technology for the most difficult transparent resins (such as acrylic and polycarbonate).

Flame-Retardant Plastics with Transparency: Tests, Underwriters Laboratories, etc. ★ An explanation of the guidelines for flame-retardant technology of transparent resins (such as acrylic and polycarbonate), which is the most challenging among polymer flame retardancy, from basics to practical applications! ☆ Examples of combustion tests for transparent resin materials (combustion tests required for LED lighting) such as UL94, UL746C, UL60950-1, etc. ★ Explanation of reliable data based on ISO/IEC17025! 【Venue】 Kawasaki City Industrial Promotion Hall, 10th Floor, Conference Room 1【Kanagawa, Kawasaki】 Date and Time July 31, 2013 (Wednesday) 13:00-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • resin

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

  • Other polymer materials
  • resin

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Single-component heat-curing epoxy resin for home appliances TE-7901K

Single-component heat-curing epoxy resin for home appliances TE-7901K

One-liquid type × high thermal conductivity! Contributes to improving the durability of home appliances.

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

  • Resin container
  • resin

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Two-component heat-curing epoxy resin for home appliances TE-7820FR3

Two-component heat-curing epoxy resin for home appliances TE-7820FR3

High Tg and flame retardant to improve the safety of electrical appliances.

In the home appliance industry, the safety and reliability of products are of utmost importance. Especially for products used in high-temperature environments, flame-retardant materials are essential. In the event of a fire, it is necessary to prevent the spread of flames and protect consumer safety. The TE-7820FR3 is equipped with flame retardancy equivalent to UL94 V-0, enhancing the safety of home appliances. 【Application Scenarios】 - Power units - Motors - Heaters 【Benefits of Implementation】 - Improved safety due to high flame retardancy - Increased product reliability - Enhanced customer satisfaction

  • Other polymer materials
  • resin

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • resin

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Wakabayashi Precision Machinery Industry - Polyether Ether Ketone

Wakabayashi Precision Machinery Industry - Polyether Ether Ketone

Very heat resistant.

It has very high heat resistance. (Continuous use temperature 240°C) (Load deflection temperature 300°C / GF 30%) It excels in flame resistance, chemical resistance, heat water resistance, fatigue resistance, low impurity content, and radiation resistance.

  • Engineering Plastics
  • resin

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Bismaleimide resin with low dielectric properties and flexibility [Sample provided]

Bismaleimide resin with low dielectric properties and flexibility [Sample provided]

【Demand in the electronic materials field】This is a new bismaleimide resin varnish that combines low dielectric properties and flexibility. Sample provision is also possible.

The 'ULTIMID 3000S' manufactured by ABC NANOTECH CO., LTD. is a Bismaleimide oligomer with low dielectric properties, which is not hydrolyzed by acids and has stable heat resistance characteristics. 【Features】 ■ Aliphatic Bismaleimide oligomer toluene solution ■ Can be cured at low temperatures (170°C) using peroxide catalysts, etc. ■ Capable of creating uncured films ■ Can be hybridized with other materials such as epoxy resins 【Characteristics as a Cured Product】 ■ The cured product has excellent electrical properties. Dielectric constant: 2.4, Dielectric loss tangent: 0.0016 (10GHz) ■ High flexibility due to the aliphatic backbone. ■ Lower water absorption rate compared to other bismaleimide resins. Water absorption rate: 0.045% ■ High heat resistance. Temperature for 5% weight loss: 436℃ ■ Curing shrinkage rate: 0.1% ■ Low transmission loss (2.5db based on 5cm, LCP is 3.9~4.0db) ◇◇ With the spread of 5G communication, we expect applications in various components for high-frequency use ◇◇ *For detailed explanations and sample requests, please feel free to contact us.

  • Testing Equipment and Devices
  • resin

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[For Robots] TE-7901K

[For Robots] TE-7901K

One-liquid type × high thermal conductivity! Heat-dissipating insulating epoxy resin that supports the precise movements of robots.

In the robotics industry, the reliability of electronic components is crucial for high-precision operation and longevity. In particular, temperature management of components that generate heat, such as motors and sensors, is a key factor that influences the performance of robots. Deterioration of components due to heat can lead to malfunctions and failures, potentially reducing the overall operational rate of the robot. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, protecting the electronic components inside the robot from heat. [Usage Scenarios] - Motors of precision robots - Heat dissipation measures for sensors - Insulation sealing for high-density mounted circuit boards [Effects of Implementation] - Extended lifespan of components - Stable operation of robots - Reduction in maintenance costs

  • Resin container
  • resin

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TE-7814V for Robot Precision Equipment

TE-7814V for Robot Precision Equipment

Improving the reliability of robotic precision equipment with high thermal conductivity and high Tg.

In the robot precision equipment industry, high operational accuracy and long lifespan are required. In particular, precise electronic components face the risk of performance degradation and failure due to heat generation. The TE-7814V addresses these issues with its high thermal conductivity, enhancing the reliability of the equipment. 【Application Scenarios】 - Electronic circuit boards for precision robots - Sensor modules - Actuators 【Benefits of Implementation】 - Suppression of malfunction due to thermal runaway - Extension of equipment lifespan - Achievement of stable operation

  • Other polymer materials
  • resin

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TE-7901K for semiconductors

TE-7901K for semiconductors

One-liquid type × high thermal conductivity! For thermal management of high-density mounted substrates.

In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency

  • Resin container
  • resin

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[For Communication Speedup] TE-7901K

[For Communication Speedup] TE-7901K

One-liquid type × high thermal conductivity! For thermal management in communication devices. Supports high-speed operation.

In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure

  • Resin container
  • resin

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High-reliability epoxy resin TE-7814V for communication equipment

High-reliability epoxy resin TE-7814V for communication equipment

Contributes to stable operation of communication devices with high thermal conductivity and high Tg.

In the telecommunications industry, stable operation over a long period is required. Particularly for electronic components that are susceptible to temperature changes and external influences, heat dissipation measures and high insulation properties are essential. The TE-7814V addresses these challenges and contributes to the reliability improvement of communication equipment. 【Application Scenarios】 - Base stations - Servers - Communication modules 【Benefits of Implementation】 - Extended lifespan of components due to improved heat dissipation - Realization of stable operation through high insulation properties - Reduction of equipment downtime

  • Other polymer materials
  • resin

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TE-7820FR3 for semiconductors

TE-7820FR3 for semiconductors

High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.

In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability

  • Other polymer materials
  • resin

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Molded and processed fabric bakelite

Molded and processed fabric bakelite

Standard laminated board used as electrical and electronic machine components.

Bakelite laminate has been widely used as an insulating material and structural material for electronic components and electromechanical applications since its launch, thanks to its excellent machinability and physical properties. 【FL-FLE (Basic Grade)】 Color: Brown (natural color), Black Applicable Standards: - JIS Standards: PL-FLE (fine thread cloth), PL-FCM (coarse thread cloth) - ANSI Standards: (LE) Features: Intermediate electrical properties, good mechanical strength, good machinability Applications: Electromechanical parts requiring impact resistance Standard Product Dimensions: - Thickness (mm): 3.0 to 100.0 - Standard Sizes: 1,020×1,020, 1,020×2,043 UL Standard: 94HB Our company precisely processes Bakelite using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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  • Composite Materials
  • Other polymer materials
  • resin

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TE-7814V for semiconductor packaging

TE-7814V for semiconductor packaging

Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

  • Other polymer materials
  • resin

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Room temperature curing type × high thermal conductivity! Epoxy resin excellent in heat dissipation insulation.

In the electronics industry, as products become smaller and more high-performance, achieving both insulation and heat dissipation has become an important challenge. In particular, electronic components with high-density mounting tend to generate heat, and insulation failure can lead to product malfunctions. TE-6430 achieves both high thermal conductivity and excellent insulation, contributing to the reliability of electronic devices. 【Usage Scenarios】 - Insulation and heat dissipation measures for motors, coils, and sensors - Protection and insulation of electronic components - Component mounting on circuit boards 【Benefits of Implementation】 - Increased longevity of electronic devices - Improved product reliability - Enhanced design flexibility

  • Other polymer materials
  • resin

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Two-component heat-curing epoxy resin for automotive use TE-7814V

Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

  • Other polymer materials
  • resin

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

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  • resin

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High Durability Epoxy Resin for Home Appliances TE-7814V

High Durability Epoxy Resin for Home Appliances TE-7814V

Achieving long-term reliability of home appliances with high thermal conductivity and high Tg.

In the home appliance industry, long-term reliability of products is required, and protecting electronic components, especially those exposed to heat and vibration, is crucial. The TE-7814V addresses these challenges with its high thermal conductivity and high Tg, contributing to the durability of home appliances. 【Usage Scenarios】 - Heat dissipation measures for electronic components prone to heating, such as motors and coils - Protection of electronic devices used in high-temperature environments - Extending the lifespan of products 【Effects of Implementation】 - Suppression of component degradation due to heat - Reduction of product failure risks - Improvement of long-term product reliability

  • Other polymer materials
  • resin

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TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

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  • Other polymer materials
  • Other electronic parts
  • resin

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Two-component room temperature curing epoxy resin TE-6430 for automotive use

Two-component room temperature curing epoxy resin TE-6430 for automotive use

Room temperature curing type × high thermal conductivity! Contributing to the bonding of automotive parts.

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. This is particularly important in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, where the performance of adhesives is critical. Improper adhesion can lead to component detachment or malfunction, potentially resulting in serious accidents. TE-6430, with its high thermal conductivity and flame retardancy, contributes to enhancing safety and reliability in the adhesion of automotive parts. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - Improved heat dissipation due to high thermal conductivity - Enhanced safety due to flame retardancy - Improved workability due to low viscosity

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TE-7820FR3 for electronic devices

TE-7820FR3 for electronic devices

High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

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TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

One-liquid type × High thermal conductivity 6.5W/mK! Contributes to the reliability improvement of electronic devices.

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

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Epoxy resin 'EPOX MK SR35K/SR3542'

Epoxy resin 'EPOX MK SR35K/SR3542'

Rubber-modified solid epoxy resin with excellent film elongation and film-forming properties.

We offer a solid epoxy resin with improved flexibility and impact resistance, known as 'EPOX MK SR35K/SR3542', which is formulated with modified rubber. In addition to the rust prevention and chemical resistance properties of epoxy resin, it excels in film elongation and film formation due to rubber modification. Please feel free to contact us if you have any inquiries. 【Basic Physical Properties】 ■Flexural Strength: 114 MPa ■Flexural Modulus: 4890 MPa ■Growth Rate: 20% ■TG: 94℃ *For more details, please download the PDF or contact us.

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