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resin(ul 94) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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resin Product List

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Bismaleimide resin with low dielectric properties and flexibility [Sample provided]

【Demand in the electronic materials field】This is a new bismaleimide resin varnish that combines low dielectric properties and flexibility. Sample provision is also possible.

The 'ULTIMID 3000S' manufactured by ABC NANOTECH CO., LTD. is a Bismaleimide oligomer with low dielectric properties, which is not hydrolyzed by acids and has stable heat resistance characteristics. 【Features】 ■ Aliphatic Bismaleimide oligomer toluene solution ■ Can be cured at low temperatures (170°C) using peroxide catalysts, etc. ■ Capable of creating uncured films ■ Can be hybridized with other materials such as epoxy resins 【Characteristics as a Cured Product】 ■ The cured product has excellent electrical properties. Dielectric constant: 2.4, Dielectric loss tangent: 0.0016 (10GHz) ■ High flexibility due to the aliphatic backbone. ■ Lower water absorption rate compared to other bismaleimide resins. Water absorption rate: 0.045% ■ High heat resistance. Temperature for 5% weight loss: 436℃ ■ Curing shrinkage rate: 0.1% ■ Low transmission loss (2.5db based on 5cm, LCP is 3.9~4.0db) ◇◇ With the spread of 5G communication, we expect applications in various components for high-frequency use ◇◇ *For detailed explanations and sample requests, please feel free to contact us.

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Molded and processed fabric bakelite

Standard laminated board used as electrical and electronic machine components.

Bakelite laminate has been widely used as an insulating material and structural material for electronic components and electromechanical applications since its launch, thanks to its excellent machinability and physical properties. 【FL-FLE (Basic Grade)】 Color: Brown (natural color), Black Applicable Standards: - JIS Standards: PL-FLE (fine thread cloth), PL-FCM (coarse thread cloth) - ANSI Standards: (LE) Features: Intermediate electrical properties, good mechanical strength, good machinability Applications: Electromechanical parts requiring impact resistance Standard Product Dimensions: - Thickness (mm): 3.0 to 100.0 - Standard Sizes: 1,020×1,020, 1,020×2,043 UL Standard: 94HB Our company precisely processes Bakelite using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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  • Composite Materials
  • Other polymer materials

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

  • Other polymer materials

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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

  • Other polymer materials

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