![[Technical Column #01] TSV Semiconductor](https://image.mono.ipros.com/public/product/image/ffa/2000999094/IPROS67274021076213109298.png?w=280&h=280)
[Technical Column #01] TSV Semiconductor
High functionality and advanced capabilities are expected with through electrodes! Introducing the current state of technology, challenges, and our company's technology.
TSVs have recently attracted attention in the 3D implementation of semiconductors. Recent trends in semiconductor development suggest that the integration of ICs (integrated circuits) is expected to progress towards 3D implementation. In this context, technologies that form electrodes in the vertical direction of substrates, such as TSVs (Through-Silicon Vias), are anticipated to significantly contribute to the 3D evolution in the semiconductor field. In this column, we will introduce TSV technology and our development of "Through-Glass Vias (TGV)" based on trends in the semiconductor sector. [Contents (Excerpt)] - TSVs are an important technology for 3D implementation of semiconductors! An overview of the current situation and challenges. - Semiconductor development is moving towards 3D implementation. - Important technologies for 3D implementation of semiconductors! *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.
- 企業：EBINAX 旧 ヱビナ電化工業(株)
- 価格：Other
