Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
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QFP IC mounting socket NQPACK series
NQPACK is a connector for QFP-IC implementation. It can also be connected to an emulator (using YQPACK) without implementing the IC. The target board can be soldered with the same foot pattern as the target IC. It supports QFP ICs ranging from 32 pins (7.0mm x 7.0mm) to 272 pins (36.0mm x 36.0mm).
We can offer affordable measurements of high-performance, multi-pin packages that integrate various chips.
Advanced packages that handle AI and big data are expected to become even more high-performance and see increased demand due to chiplets. The measurement of these high-performance advanced packages requires stable contacts with high-speed operation and multiple pins. The only method that can achieve both is PCR. PCR sockets leverage the advantages of sheet contact to realize stable connections over short distances while offering cost benefits for multiple pins. To address warping issues common in large packages, we adjust the contact positions at the center and outer edge on the PCR side, alleviating concerns about insufficient stroke length. For detailed specifications, we conduct individual designs for each project, so please feel free to contact our office. (We can also accommodate packages exceeding 10,000 pins.)
Select the right materials according to the target device and testing environment! Production is possible from just one piece!
We propose sockets that are compatible with almost all packages. For custom products made through machining, production can be done from a quantity of one. Depending on the production quantity, we can also create molded sockets by starting a mold. We accommodate a wide range of packages, from small packages under 1.0mm to ICs exceeding 1,000 pins. We excel in various mechanical designs, so please feel free to consult us if you have any concerns. 【Features】 ■ Proposing sockets compatible with almost all packages ■ Capable of creating molded sockets by starting a mold ■ Selecting appropriate materials according to the target devices and testing environments ■ Wide compatibility from small packages under 1.0mm to ICs exceeding 1,000 pins ■ Expertise in various mechanical designs *For more details, please refer to the PDF materials or feel free to contact us.
We have a track record of deliveries to major domestic semiconductor manufacturers.
**Features** - By compacting the socket mechanism, the socket size has been minimized, reducing the mounting area on the circuit board. - You can select suitable contacts that match your usage conditions (contacts for room temperature applications are available). - It has a PKG separation mechanism to address sticking issues that occur during burn-in testing. - By machining the socket adapter, it can accommodate a variety of package shapes. **Specifications** - Contact pressure: 11–14g/pin (for high temperature) 17–22g/pin (for room temperature) - Initial contact resistance: 200–300mΩ - Operating temperature: -40 to +150℃ - Maximum allowable current: 0.6amp *For more details, please feel free to contact us.*
We will introduce tools for inserting and securing semiconductor IC packages.
The "IC Test Socket Comprehensive Catalog" is a catalog that includes a wide range of TEST SOCKETS and BURN-IN SOCKETS from ENPLAS SIMULATION TECHNOLOGY and ENPLAS LONG LIFE CONTACT SOLUTION. The "IC Test Socket" from Enplas Semiconductor Equipment Co., Ltd. meets all needs related to the increasing pin count and fine pitch associated with high integration of ICs. 【Featured Products】 ○ ENPLAS SIMULATION TECHNOLOGY ［ENPLAS LONG LIFE CONTACT SOLUTION] ○ TEST SOCKET ○ BURN-IN SOCKET, etc. For more details, please contact us or download the catalog.
Certified to safety standards of various countries. For extending the power supply of portable electric devices and power tools.
The 2-pin female plug "TC-10" can be used as an extension cable of lengths 3m, 5m, or over 10m when combined with our 2-pin male plug.
3P socket (female) certified simultaneously by PSE/BSMI/UL/CUL, perfect for portable electrical products!
This is a 3P socket (female) power cable that has obtained PSE/BSMI/UL/CUL standards. To extend the power cable, we offer combination products with male plug "TP-11" in lengths of 3M, 5M, and 10M. Dai-An Electric Co., Ltd. produces power plugs, power cords, and vinyl sheathed cables with PSE/BSMI/UL/CUL marks, and conducts strict inspections before shipment.
We can propose a socket structure that does not require LID for measurements such as image sensors that need optical testing.
In measurements such as those involving image sensors, it is essential to incorporate light; however, in a typical socket structure, the presence of a pressurized LID can create a situation where light has difficulty entering. To address this issue, PCR has developed a LID LESS socket that distorts the contactor by attracting the package from the backside in a vacuum, allowing for conduction. The absence of a pressurized LID enables free light intake, eliminating constraints in socket design. Additionally, the lack of a LID simplifies and reduces the cost of the socket, making it feasible for cost reduction efforts beyond just image sensor measurement applications. However, since the pressure is determined by atmospheric pressure, there may be cases that cannot be accommodated depending on the size and pin count of the semiconductor package. For detailed specifications, we will conduct individual designs for each project, so please feel free to contact our company for inquiries.
Affordable proposal for measuring high-performance, multi-pin packages.
For AI and big data processing, high-performance and high-density advanced package semiconductor testing requires multi-pin support and high-speed operation. A measurement method that can achieve stable contact and cost efficiency is essential. PCR sockets provide stable contact through short-distance connections and cost benefits through multi-pin support. They also accommodate warping of large packages, alleviating concerns about insufficient stroke. 【Use Cases】 - Testing high-performance chips for AI - Package testing for chiplet structures - Testing packages with a high number of pins 【Benefits of Implementation】 - Realization of stable electrical connections - Cost-effective testing solutions - Capable of handling packages with over 10,000 pins
For high-performance, multi-pin package measurement for miniaturized automotive electronic devices.
In the automotive industry, there is a simultaneous demand for miniaturization and high performance of in-vehicle electronic devices. Particularly with the evolution of ADAS (Advanced Driver Assistance Systems) and autonomous driving technology, the reliability evaluation of densely packaged semiconductor packages has become crucial. To pack more functions into limited space, the adoption of multi-pin packages is increasing. Sockets for advanced packages have been developed to meet these needs. 【Usage Scenarios】 - Testing of in-vehicle ECUs - Evaluation of ADAS-related devices - Reliability testing of automotive SoCs 【Benefits of Implementation】 - Stable measurement of multi-pin packages - Compatibility with miniaturized devices - Provision of cost-effective measurement solutions
Achieve low-cost measurement of multi-pin packages and contribute to bandwidth expansion.
In the telecommunications industry, with the spread of high-speed communication standards such as 5G and 6G, bandwidth expansion has become a crucial challenge to accommodate the increase in data transfer volume. High-performance chips that adopt advanced packaging (such as chiplet structures) support this bandwidth expansion, but measuring them requires measurement methods that can handle multiple pins and operate at high speeds. PCR sockets enable stable contact and cost efficiency, making it possible to measure multi-pin packages. They provide stable contact through short-distance connections and cost benefits, contributing to the performance improvement of communication infrastructure. 【Use Cases】 - 5G/6G base stations - Data centers - High-speed communication devices 【Benefits of Implementation】 - Stable measurement of multi-pin packages - Improved cost efficiency
This is a socket with a seat on one side. It can be connected and secured to a pipe.
This is a socket with a seat on one side. It can be connected and secured to a pipe.
It is a fitting that is half a socket, allowing PVC pipes to be connected from only one side.
A half socket is a fitting that has been cut in half, allowing PVC pipes to be connected from only one side.
Achieving high-density package measurement at a low cost. Balancing stable contact and cost efficiency.
In the data center industry, there is an increasing demand for high-performance and high-density semiconductor packages due to the rise of AI and big data processing. In the testing of these packages, multi-pin support and high-speed operation are essential. It is important to have measurement methods that ensure stable electrical connections while also achieving cost efficiency. Our "Advanced Package Socket" utilizes PCR technology to achieve short-distance connections and stable contact, providing cost advantages in multi-pin package testing. It also accommodates warping in large packages, alleviating concerns about insufficient stroke. 【Use Cases】 - Testing of high-density packages - Measurement of multi-pin packages - Testing of chips for AI and big data processing 【Benefits of Implementation】 - Ensuring stable electrical connections - Improving cost efficiency - Supporting high-speed operation testing
This is a fitting with a flange and nut for connecting PVC pipes.
A threaded socket is a fitting with a flange and nut that connects PVC pipes. It is designed to be fixed to FRP tanks, making it suitable for use as an inlet/outlet or vent for septic tanks and similar applications.
We propose affordable measurement of high-performance, multi-pin packages that fuse various chips.
In the IoT industry, the miniaturization and high performance of devices are advancing, leading to a demand for multi-pin semiconductor packages and support for high-speed data communication. Stable connectivity and high reliability are crucial factors that influence the performance of IoT devices. Advanced package sockets leverage the characteristics of PCR sockets to achieve stability and cost efficiency in multi-pin connections. 【Usage Scenarios】 - Testing high-performance chips for IoT devices - Situations requiring stable connections for multi-pin packages - Inspection of IoT devices that require high-speed data communication 【Benefits of Implementation】 - Improved reliability of testing due to stable contacts - Realization of cost-efficient multi-pin connections - Compatibility with a variety of IoT devices
This is a U-shaped socket made of PVC. You can connect a pipe to the receiving end to create a U-pipe.
It is a U-shaped socket. You can connect a pipe to the receiving end to create a U-shaped pipe.
High-frequency measurement sockets supporting signal quality in the 5G/6G era.
In the telecommunications industry, with the spread of 5G/6G, there is a demand for high-speed and large-capacity communication, making the maintenance of signal quality crucial. Accurate measurements are essential in testing high-frequency devices, and even slight signal degradation is unacceptable. The PCR socket addresses challenges in high-frequency measurements through free design of electrode diameter and short-distance connections, enabling stable measurements. It is also capable of millimeter-wave measurements. 【Usage Scenarios】 - Characterization evaluation of 5G/6G compatible devices - Quality inspection of devices for base stations - Signal integrity measurement for high-speed transmission lines 【Benefits of Implementation】 - Improved product quality through accurate measurement of high-frequency characteristics - Reduced development time by achieving a stable measurement environment - Compatibility with a wide frequency range, including the millimeter-wave band
