substrate×山下マテリアル - メーカー・企業と製品の一覧

Low-loss flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

企業：山下マテリアル
価格：Other

Wiring materials

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Ultra-small diameter through-hole substrate with 4-layer filled blind vias.

Formation of through holes with a diameter of 25μm or less. Since components can be mounted on top of the vias, space-saving is achieved.

The "Ultra-small diameter through hole" is a flexible substrate designed to have holes filled by 15μm through-hole plating. It is possible to form through holes with a diameter of 25μm or less on double-sided flexible substrates. Additionally, we also offer "4-layer filled blind vias," which allow for the filling of blind vias through plating on 4-layer flexible substrates. 【Specifications】〈Ultra-small diameter through hole〉 ■ Base polyimide: 50μm ■ Conductor thickness: 12μm ■ Hole diameter (entry side): φ20μm ■ Hole diameter (exit side): φ15μm ■ Land diameter: 95μm *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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High Current Compatible Flexible Circuit Board BigElec

The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Other electronic parts

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Ground slit MSL structure flexible printed circuit board

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Printed Circuit Board
High frequency/microwave parts
Wiring materials

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YFC "LVDS Type Coplanar (RFC)"

Co-planar structure with unilateral wiring! We have two types of lineup available.

The "LVDS Type Coplanar (RFC)" is a high-performance type of the YFC series. It uses liquid crystal polymer, which is a low dielectric constant material, for the base film to reduce transmission loss. There are two types available: one that uses polyimide film for insulation (RFC1) and another that uses liquid crystal polymer film (RFC2). Additionally, due to its coplanar structure with single-sided wiring, it offers the greatest flexibility among our LVDS-compatible flat cables. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Offers the greatest flexibility among LVDS types due to single-sided wiring *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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YFC "Type with Shield (SFC)"

Excellent flexibility! An essential item in situations where EMC measures are necessary.

The "L Shielded Type (SFC)" is equipped with a shield film applied to our YFC. An essential item in scenes where EMC measures are required. The shield film uses a thin membrane, ensuring that flexibility is not compromised. 【Features】 ■ YFC cable using shield film ■ Utilizes thin film shielding ■ Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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YFC "LVDS Type Strip Line (RFS)"

Improved bending performance with the adoption of mesh GND! EMC measures are implemented with a shielding film.

The "LVDS Type Strip Line (RFS)" uses liquid crystal polymer, a low dielectric material, as the base film, aiming to reduce transmission loss. Additionally, it is suitable for EMC measures due to the use of a shielding film. The adoption of a mesh ground improves flexibility. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Implements EMC measures with a shielding film ■ Improves bending performance through the adoption of a mesh ground *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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YFC "LDVS Type Microstrip Line (RFM)"

Improved flexibility with the adoption of mesh GND! Compatible with manual soldering as well.

The "LDVS Type Microstrip Line (RFM)" is a high-performance version of the popular YFC series. It uses liquid crystal polymer (LCP), a low dielectric constant material, as the base film to reduce transmission loss. There are types ranging from RFM1 to RFM4, so please check the catalog for details. We offer two types for insulation: one using liquid crystal polymer film and the other using polyimide film. The type using liquid crystal polymer film for insulation aims for further reduction in transmission loss. Please choose according to the scene in which you will be using it. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ The type using polyimide for the coverlay can accommodate hand soldering ■ Improved bending performance due to the adoption of mesh GND *For more details, please refer to the PDF materials or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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YFC "LDVS Type with Ears and Notched Type"

The total length of the cable can be made to your specified length (up to 340mm), number of cores, and pitch!

The "LDVS Type with Ear and Notch" features a locking mechanism with protrusions and recesses on the terminal part, tailored to the specifications of the connector. It is particularly suitable for environments with high vibrations, use in equipment under tension, or situations where twisting is applied to the drive part, as it helps prevent connector disconnection. The total length of the cable can be made to your specified length (up to 340mm), number of cores, and pitch. 【Features】 ■ Compatible with the protrusions and recesses of the specified connector terminal ■ Can be made to your specified length, number of cores, and pitch ■ Compliant with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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Space-saving with increased winding count! 'Multilayer Coil Flexible Circuit Board'

It can carry a larger current than a standard flexible circuit board, making it suitable for use in motors, power supply coils, and sensors.

The "multi-layer coil flexible substrate" has a conductor thickness of 75μm to 90μm, making it suitable for high current applications compared to standard flexible substrates. It allows for increased winding numbers in a compact space, making it promising for use in motors, power supply coils, and sensor applications. Additionally, it can be bent and integrated into narrow spaces, achieving a flat, thin, and lightweight design. 【Features】 ■ Possible to increase winding numbers in a compact space ■ Achieves a flat, thin, and lightweight design ■ Can be bent and integrated into narrow spaces ■ Expected to be used in motors, power supply coils, and sensor applications *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Wiring materials

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Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Wiring materials

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High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

企業：山下マテリアル
価格：500,000 yen-1 million yen

Harness

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Heat-resistant printed circuit board

It has excellent heat resistance and can be used in high-temperature environments where it is difficult to adopt in standard printed circuit boards!

We provide high heat-resistant printed circuit boards using Okitsumo's high heat-resistant solder resist ink "TAINEX Series" and FR-4 high heat-resistant grade materials. These boards have excellent heat resistance and can be used in high-temperature environments where standard printed circuit boards are difficult to employ. They are made from halogen-free materials and comply with various environmental regulations. Please feel free to contact us when you need assistance. 【Features】 ■ Continuous heating: 150℃ / 1000h - No swelling or peeling ■ Continuous heating: 175℃ / 1000h - No swelling or peeling ■ Temperature cycle (-65℃ ⇔ 150℃) × 3000 cycles achieved - No swelling or peeling ■ Made from halogen-free materials and compliant with various environmental regulations *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Printed Circuit Board

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Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*