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substrate×アロー産業 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

16~19 item / All 19 items

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Water-cooled flow circuit board

Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.

The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Multilayer metal base substrate

Introducing a multilayer metal base substrate that supports high-density wiring!

The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Metal (copper, aluminum) bump substrate

Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.

The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Metal base single-sided board

Introducing a printed circuit board with an insulating layer on a metal surface, copper foil arranged, and circuits formed on top!

The "metal base single-sided substrate" is a printed circuit board that has an insulating layer and copper foil on a metal surface, with circuits formed on top of it. The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications. It is proposed for thermal management of high-brightness LEDs and high-power semiconductors. 【Features】 ■ Insulating layer and copper foil are arranged on the metal surface, with circuits formed on top ■ The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications ■ Proposed for thermal management of high-brightness LEDs and high-power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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