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substrate×アーセルデザイン - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Special substrate

We have various design achievements such as thick copper foil substrates, high aspect ratio substrates, and copper inlay substrates!

At Arcel Design, we also accommodate special substrates. We have design achievements in through resin-filled substrates, IVH substrates, thick copper foil substrates, high-frequency substrates, high-aspect substrates, back-drill substrates, copper-inlay substrates, and build-up substrates. Please feel free to consult us when you need assistance. 【Design Achievements (Partial)】 ■ Through resin-filled substrates ■ IVH substrates ■ Thick copper foil substrates ■ High-frequency substrates ■ High-aspect substrates *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing

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High-frequency substrate

High-frequency substrate

For high-frequency substrates (with proven results above 24GHz) and high-speed transmission substrates (with proven results above 40Gbps), we can accommodate proposals for layer composition and materials (MEG6) considering the components mounted on the substrate and their density.

  • others

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High-density substrate

High-density substrate

We will propose and accommodate ultra-high-density designs, such as setting the space between components like CR to 0.3mm, using through-hole substrates, build-up/IVH, and through resin filling specifications.

  • others

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Power supply board

Power supply board

We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.

  • others

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Flexible circuit board

Flexible circuit board

We can accommodate everything from single-sided flexible printed circuit boards to multi-layer flexible printed circuit boards, including assembly.

  • others

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Through-hole resin-filled substrate

Through-hole resin-filled substrate

This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.

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Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

We have a wealth of experience in designing narrow pitch BGA mounted boards. Regarding board manufacturing, we will select and propose manufacturers that are capable of production.

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