Last Updated： Aggregation Period:Jun 03, 2026～Jun 30, 2026
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We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.
We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class supplier in the industry. You can purchase as little as one item. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.
The SrTiO3 (STO) substrates from Shinko Electric Industries are a long-selling product that is beloved by thin film researchers around the world.
The SrTiO3 (STO) substrates from Shinko Electric Industries have been a long-selling product favored by thin film researchers worldwide since the 1980s. We also offer options such as Nb-doped products with conductivity, step and terrace treatment, and break groove (chocolate bar-shaped) processed items.
We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.
We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.
![[Document] TCS4-100/150 Calibration Board Instruction Manual](https://image.mono.ipros.com/public/product/image/502/2000883991/IPROS80197569536358788298.png?w=280&h=280)
Manufacturing of dedicated calibration kits available (custom)! Introducing TCS4-100/150.
This document contains the specifications for the calibration board "TCS4-100/150" handled by Techno Probe Inc. It features a high-precision load pad with an accuracy of ±0.3%, and is a SOLT/TRL calibrator. It is a simple and easy-to-reference booklet. We encourage you to read it. 【Contents (partial)】 ■Substrate top view ■Pattern list ・Top ・Bottom *For more details, please refer to the PDF document or feel free to contact us.
![[Document] TCS3-200 Calibration Board Instruction Manual](https://image.mono.ipros.com/public/product/image/c4e/2000883977/IPROS78366375766509775829.png?w=280&h=280)
Pad pitch 175–225μm! Introducing the element symbols and positions of the TCS3-200.
This document contains the specifications for the calibration board "TCS3-200" handled by Techno Probe Inc. We introduce pattern names such as Loop-Back Thru1 and Cross Thru1. It is a simple and easy-to-reference book. Please take a moment to read it. 【Contents (partial)】 ■ Pattern List ■ Substrate Top View *For more details, please refer to the PDF document or feel free to contact us.
![[Document] TCS4-200/250 Calibration Board Manual](https://image.mono.ipros.com/public/product/image/a9a/2000884004/IPROS11457693216173103706.png?w=280&h=280)
Pad size 65μm × 50μm! Introducing the substrate top view and pattern list.
This document includes the calibration board "TCS4-200/250" handled by Techno Probe Inc. It introduces the arrangement, pad pitch, applications, and positions of the components. It is a simple and easy-to-reference booklet. Please take a moment to read it. 【Contents (partial)】 ■ Pattern Name ■ Mounted Component Symbols ■ Applications ■ Positions of Components *For more details, please refer to the PDF document or feel free to contact us.
![[Document] TCS1-/TCS2- Calibration Board Manual](https://image.mono.ipros.com/public/product/image/b82/2000878048/IPROS48784072824046124645.png?w=280&h=280)
±0.3% high precision load pad equipped! Custom calibration kit can be manufactured.
We would like to introduce the calibration board manual for "TCS1-/TCS2-" handled by Techno Probe Co., Ltd. It includes information such as pad size, pad pitch, pattern names, component symbols, applications, and the positions of components. The product's top view is also included, making it a useful reference when considering implementation. 【Contents】 1. Pattern List 2. Substrate Top View *For more details, please refer to the PDF document or feel free to contact us.
![RF probe and calibration board [Wide frequency range, pitch, excellent durability!]](https://image.mono.ipros.com/public/product/image/8e8/2000345762/IPROS2066429142905764199.png?w=280&h=280)
An RF probe and calibration board with a wide frequency range, pitch, and excellent durability!
Our company offers RF probes and calibration substrates with a wide frequency range, pitch, excellent durability, all at a low price. Thanks to our unique tip shape, stable contact can be achieved with minimal skating during contact, reducing damage to devices and ensuring high reproducibility. The calibration assist software already has product data for the "Allstron TITAN Probe Series" registered, allowing you to use it immediately by simply selecting a probe. 【Product List】 ■Allstron RF Probe "TITAN" ■Allstron RF Probe "TITAN-RC" ■RF Calibration Substrates "AC" ■Calibration software "QAlibria" *For more details, please request materials or view the PDF data available for download.
We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.
We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.
Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.
"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.
![Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]](https://image.mono.ipros.com/public/product/image/aef/2000837251/IPROS92922931863825394276.png?w=280&h=280)
Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!
In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.
![[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates](https://image.mono.ipros.com/public/product/image/07b/2001468226/IPROS36719060859120934293.jpeg?w=280&h=280)
World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...
This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.
![[Market Report] Global Market for Ceramic Substrates](https://image.mono.ipros.com/public/product/image/e69/2000948897/IPROS94976007637107731834.jpeg?w=280&h=280)
Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market
The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.
![[Research Material] Global Market for Semi-Insulating SiC Substrates](https://image.mono.ipros.com/public/product/image/db3/2001463731/IPROS32029003209614041608.jpeg?w=280&h=280)
World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...
This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.
