We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

substrate(art) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

substrate Product List

61～67 item / All 67 items

Displayed results
[Research Material] Global Market for Semiconductor and IC Packaging Materials

[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Solder Balls ...

This research report (Global Semiconductor and IC Packaging Materials Market) investigates and analyzes the current state and future outlook of the global market for semiconductor and IC packaging materials over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, ceramic packages, solder balls, and others, while the segments by application cover the electronics industry, medical, automotive, telecommunications, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for semiconductor and IC packaging materials. The report also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

  • Other services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Research Material] Global Market for Display Glass Substrates

[Research Material] Global Market for Display Glass Substrates

Global Market for Display Glass Substrates: LCD Display Type, LED Display Type, OLED Display Type, Television, Computer ...

This research report (Global Glass Substrates for Displays Market) investigates and analyzes the current status and outlook for the global market of glass substrates for displays over the next five years. It includes information on the overview of the global glass substrates market for displays, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments for glass substrates for displays by type include LCD display type, LED display type, and OLED display type, while the segments by application cover televisions, computers, smartphones, tablet devices, automobiles, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for glass substrates for displays. The report also includes the market share of major companies in the glass substrates for displays market, product and business overviews, and sales performance.

  • Other services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Research Material] Global Market for Alumina DBC (DBC Substrates)

[Research Material] Global Market for Alumina DBC (DBC Substrates)

World Market for Alumina DBC (DBC Substrates): Alumina 96%, Others, Power Electronics, Automotive Electronics, Home Appliances & C ...

This research report (Global Alumina DBC (Direct Bond Copper Substrate)) investigates and analyzes the current state and future outlook of the global alumina DBC (DBC substrate) market over the next five years. It includes information on the overview of the global alumina DBC (DBC substrate) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type for alumina DBC (DBC substrate) focus on alumina 96% and others, while the segments by application cover power electronics, automotive electronics, home appliances & CPV, aerospace & others. The regional segments calculate the market size of alumina DBC (DBC substrate) by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the alumina DBC (DBC substrate) sector, product and business overviews, and sales performance.

  • Other services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to substrate

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.