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更新日： 集計期間:Feb 25, 2026～Mar 24, 2026
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substrateの製品一覧

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • 企業：HNS
  • 価格：Other
  • others
  • Printed Circuit Board
  • substrate

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

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Residue-free low-temperature drying masking ink 'Peeelink MF'

Residue-free low-temperature drying masking ink 'Peeelink MF'

Newly developed masking ink! It leaves no residue and is less likely to leave peeling marks. It is halogen-free!

Peeelink MF" is a low-temperature drying masking ink that leaves no residue on the protected object after peeling. It can be applied through various methods such as screen printing, spray application, dispenser application, and brush application, making it suitable for processing shapes regardless of curvature. It is ideal for protecting electronic device displays and for paint masking. It complies with RoHS and REACH regulations, and does not produce contaminants even under environmental testing, ensuring safe use from an environmental perspective. 【Features】 ■ Film formation possible at low temperature in a short time (70℃/10min) ■ Easy to peel off with tape ■ Ideal for preventing scratches during shipping and processing ■ Halogen-free *For detailed information, please request through "Contact Us.

  • sub１.jpg
  • sub2.JPG
  • paint
  • substrate

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Automotive LED light/power supply board

Automotive LED light/power supply board

This is a circuit board for car light lamps, so materials with good heat dissipation are required. Therefore, it is designed as a double-sided board with an aluminum base.

Stratum 2L (with single layer metal board) Board thickness 1.8 mm Base material FR-4 + MCPCB (aluminum base) Copper thickness 2 Oz Surface treatment OSP

  • Other electronic parts
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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VMIVME-2210

VMIVME-2210

64-Channel Latching or Momentary Relay Board with Built-in-Test

The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.

  • Embedded Board Computers
  • substrate

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[Research Material] Global Market for Metal Adhesives

[Research Material] Global Market for Metal Adhesives

World Market for Metal Adhesives: Acrylic-based, Silicone-based, Others, Metal-Metal, Metal-Plastic, Metal-Wood

This research report (Global Metal Adhesive Market) investigates and analyzes the current state of the global metal adhesive market and its outlook for the next five years. It includes information on the overview of the global metal adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the metal adhesive market include acrylic-based, silicone-based, and others, while the segments by application focus on metal-to-metal, metal-to-plastic, and metal-to-wood. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of metal adhesives. It also includes the market share of major companies in the metal adhesive sector, product and business overviews, and sales performance.

  • Other services
  • substrate

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[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

World Market for Active Metal Brazing (AMB) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), ...

This research report (Global Active Metal Brazed (AMB) Substrates Market) investigates and analyzes the current state and future outlook of the global active metal brazed (AMB) substrates market over the next five years. It includes information on the overview of the global active metal brazed (AMB) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the active metal brazed (AMB) substrates market by type include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and others, while the segments by application cover power electronics, automotive electronics, home appliances, aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of active metal brazed (AMB) substrates. It also includes the market share of major companies in the active metal brazed (AMB) substrates market, product and business overviews, and sales performance.

  • Other services
  • substrate

ブックマークに追加いたしました

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これ以上ブックマークできません

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